Electronic device and heat radiation device utilizing liquid cooling heat radiation and cooling method thereof

A liquid-cooled heat dissipation and electronic device technology, applied in cooling/ventilation/heating transformation, electrical digital data processing, instruments, etc., can solve problems such as low heat exchange efficiency, reduce energy consumption, expand application scope, and strengthen heat exchange. Effect

Active Publication Date: 2015-11-04
沈珂
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These two solutions can only cool and deal with the heat emitted by heat-generating devices with regular heat-dissipating surfaces such as CPU and GPU, but are powerless to other heat-generating devices on the circuit board, such as memory, resistors and other components,

Method used

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  • Electronic device and heat radiation device utilizing liquid cooling heat radiation and cooling method thereof
  • Electronic device and heat radiation device utilizing liquid cooling heat radiation and cooling method thereof
  • Electronic device and heat radiation device utilizing liquid cooling heat radiation and cooling method thereof

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[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0045] like figure 1 As shown, the present invention provides an electronic device that uses liquid cooling to dissipate heat, including a housing 1, a circuit board 2, and a liquid cooling module, and the circuit board 2 and the liquid cooling module are placed in the housing 1 , the housing 1 is composed of a plurality of wall panels to form a closed space, at least one detachable wall panel 11 is provided in the plurality of wall panels, and one or more heating ...

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Abstract

The invention provides an electronic device utilizing liquid cooling heat radiation. The electronic device comprises a shell, a circuit board and a liquid cooling heat radiation module. The circuit board and the liquid cooling heat radiation module are arranged in the shell. The circuit board is provided with one or multiple heating devices. The liquid cooling heat radiation module comprises a liquid inlet pipeline and nozzles which are arranged on the liquid inlet pipeline. Cooling liquid is conducted into the shell from the outside of the shell by the liquid inlet pipeline. Cooling liquid is sprayed in a space formed by the shell by the nozzles to cool the heating devices. Cooling liquid steam after heat exchange is mixed with cooling liquid sprayed by the nozzles so that the cooling liquid steam is enabled to be condensed. Compared with an existing direct liquid cooling heat radiation device, the electronic device utilizing liquid cooling heat radiation has advantages of being low in demand for cooling liquid, low in weight, simple in system structure, high in heat exchange capability and high in environmental adaptability and has quite high application potential.

Description

technical field [0001] The invention relates to the field of liquid cooling, in particular to an electronic device utilizing liquid cooling to dissipate heat, a heat dissipating device and a cooling method thereof. Background technique [0002] With the advancement of science and technology, data centers are developing rapidly, but energy consumption remains high. According to statistics, cooling energy consumption has accounted for 40% of the total energy consumption in data centers. It is urgent to reduce cooling energy consumption and improve the operating efficiency of data centers. At present, IT equipment such as servers used in data centers basically adopts air-cooling technology to cool IT equipment such as servers. Its main feature is that it uses a fan to blow air across the surface of the heating device. Since the heat transfer coefficient between the air and the heat-generating components in the server is small, there must be a large heat transfer temperature d...

Claims

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Application Information

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IPC IPC(8): H05K7/20G06F1/20
Inventor 沈珂
Owner 沈珂
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