Electronic device and heat radiation device utilizing liquid cooling heat radiation and cooling method thereof

Abstract

The invention provides an electronic device utilizing liquid cooling heat radiation. The electronic device comprises a shell, a circuit board and a liquid cooling heat radiation module. The circuit board and the liquid cooling heat radiation module are arranged in the shell. The circuit board is provided with one or multiple heating devices. The liquid cooling heat radiation module comprises a liquid inlet pipeline and nozzles which are arranged on the liquid inlet pipeline. Cooling liquid is conducted into the shell from the outside of the shell by the liquid inlet pipeline. Cooling liquid is sprayed in a space formed by the shell by the nozzles to cool the heating devices. Cooling liquid steam after heat exchange is mixed with cooling liquid sprayed by the nozzles so that the cooling liquid steam is enabled to be condensed. Compared with an existing direct liquid cooling heat radiation device, the electronic device utilizing liquid cooling heat radiation has advantages of being low in demand for cooling liquid, low in weight, simple in system structure, high in heat exchange capability and high in environmental adaptability and has quite high application potential.

Description

technical field [0001] The invention relates to the field of liquid cooling, in particular to an electronic device utilizing liquid cooling to dissipate heat, a heat dissipating device and a cooling method thereof. Background technique [0002] With the advancement of science and technology, data centers are developing rapidly, but energy consumption remains high. According to statistics, cooling energy consumption has accounted for 40% of the total energy consumption in data centers. It is urgent to reduce cooling energy consumption and improve the operating efficiency of data centers. At present, IT equipment such as servers used in data centers basically adopts air-cooling technology to cool IT equipment such as servers. Its main feature is that it uses a fan to blow air across the surface of the heating device. Since the heat transfer coefficient between the air and the heat-generating components in the server is small, there must be a large heat transfer temperature d...

AI Technical Summary

Problems solved by technology

These two solutions can only cool and deal with the heat emitted by heat-generating devices with regular heat-dissipating surfaces such as CPU and GPU, but are powerless to other heat-generating devices on the circuit board, such as memory, resistors and other components, so they often need to be combined with air cooling

In addition, since the cooling liquid is not in direct contact with the heat-generating device, there is contact thermal resistance and conduction thermal resistance in the middle, resulting in low heat transfer efficiency

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