Composite material as well as preparation method and application thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- NANKAI UNIV
- Publication Date
- 2021-01-12
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Abstract
Description
technical field
[0001] This application belongs to the field of materials. In particular, the application relates to composite materials, their preparation methods and uses. More specifically, the application relates to the technical fields of heat dissipation, electromagnetic wave shielding, and electrical connection of electronic equipment, and in particular to a flexible composite film with high conductivity, strong heat dissipation and electromagnetic shielding performance, and its preparation method and application. Background technique
[0002] With the explosive development of electronic information technology, electronic equipment tends to be smaller and thinner, the integration of various components (such as chips) inside the equipment is getting higher and higher, and the performance of the devices is also rising. What is more important is the higher heat generation and electromagnetic wave radiation power per unit area, causing heat dissipation and electromagneti...