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Housing assembly, antenna assembly and electronic equipment

A technology of shell components and antenna modules, which is applied to antenna components, antennas, antenna coupling, etc., can solve problems such as poor communication performance of millimeter wave signals, and achieve the effect of improving transmittance and communication performance

Active Publication Date: 2022-01-04
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
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Problems solved by technology

[0003] The present application provides a shell assembly, antenna module and electronic equipment to solve the technical problem of poor communication performance of traditional millimeter wave signals

Method used

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  • Housing assembly, antenna assembly and electronic equipment
  • Housing assembly, antenna assembly and electronic equipment
  • Housing assembly, antenna assembly and electronic equipment

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Embodiment Construction

[0067] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0068] Please also refer to figure 1 , figure 1 It is a schematic structural diagram of the housing assembly provided in the first embodiment of the present application. The housing assembly 100 includes a dielectric substrate 110 and a wave-transmitting structure 120 . The dielectric substrate 110 has a first transmittance to radio frequency signals in a predetermined frequency band; the wave-transparent structure 120 is carried on the dielectric substrate 110 and covers at least...

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Abstract

The present application provides a housing assembly, an antenna assembly, and an electronic device. The housing assembly includes a dielectric substrate and a wave-transmitting structure. The dielectric substrate has a first transmittance to the radio frequency signal of the preset frequency band; the wave-transparent structure includes first and second wave-transparent layers coupled to each other, the first and second wave-transparent layers are stacked on the dielectric substrate at intervals, and the wave-transparent structure Covering at least a partial area of ​​the dielectric substrate; the shell assembly has a second transmittance for radio frequency signals of a preset frequency band in the area corresponding to the wave-transparent structure, and the second transmittance is greater than the first transmittance. The shell assembly provided by the present application carries the wave-transparent structure on the dielectric substrate, and through the interaction between the first wave-transparent layer and the second wave-transparent layer in the wave-transparent structure, the transmittance of radio frequency signals in the preset frequency band is improved. , when the housing assembly is applied to electronic equipment, the impact of the housing assembly on the radiation performance of the antenna module disposed inside the housing assembly can be reduced, thereby improving the communication performance of the electronic equipment.

Description

technical field [0001] The present application relates to the field of electronic equipment, in particular to a housing assembly, an antenna assembly and electronic equipment. Background technique [0002] With the development of mobile communication technology, traditional fourth-generation (4th-Generation, 4G) mobile communication cannot meet people's requirements. The fifth generation (5th-Generation, 5G) mobile communication is favored by users due to its high communication speed. For example, when using 5G mobile communication to transmit data, the transmission speed is hundreds of times faster than that of 4G mobile communication. Millimeter wave signals are the main means to realize 5G mobile communication. However, when millimeter wave antennas are applied to electronic equipment, millimeter wave antennas are usually set in the storage space inside the electronic equipment, and the millimeter wave signal antenna radiates out through the electronic equipment. The tr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04M1/18H04B1/3888H01Q21/08H01Q21/00H01Q1/52H01Q1/50H01Q1/38H01Q1/24H01Q1/22
CPCH04M1/18H04B1/3888H01Q1/22H01Q1/243H01Q1/38H01Q1/50H01Q1/523H01Q21/00H01Q21/08H01Q1/42H01Q15/0026H01Q1/422H01Q9/0414
Inventor 贾玉虎
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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