Automatic heating and bending device

A bending device and automatic heating technology, applied in the direction of feeding device, positioning device, storage device, etc., can solve the problems of low process integration, too fast cooling, difficult temperature control, etc., to achieve high process integration and improve production. The effect of efficiency

Pending Publication Date: 2021-01-19
江苏实为半导体科技有限公司
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0003] However, the existing bending equipment mostly uses flame heating to heat the workpiece. After heating, the cooling is too fast and the temperature is difficult to control, resulting in high brittleness of the workpiece and easy breakage during the bending process.
On the other hand, the existing bending equipment has a single processing procedure, and a set of equipment can only realize the processing of one procedure, and the process integration is low.

Method used

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Embodiment Construction

[0029] The specific embodiments of the present invention will be briefly described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other implementations obtained by those skilled in the art without creative work Examples, all belong to the protection scope of the present invention.

[0030] Figure 1-Figure 3 A preferred embodiment of the present invention is shown, and its structure is analyzed in detail from different angles.

[0031] Such as figure 1 , 2 The shown automatic heating bending device includes a frame 1 , a control cabinet 2 , a feeding mechanism, a bending assembly and a heater 4 .

[0032] Among them, the frame 1 is used to install the whole device, and the control cabinet 2 is used to control the power on and off of the heater 4, control the operation of the cylinder in the feeding me...

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PUM

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Abstract

The invention discloses an automatic heating and bending device, and relates to the technical field of semiconductor part manufacturing. The device comprises a rack, a control cabinet, a feeding mechanism arranged at the feeding end of the rack, a bending assembly arranged on the rack and a heater arranged between the feeding mechanism and the bending assembly. According to the automatic heating and bending device, a connecting rod mechanism and a telescopic die core which are used for assisting in product bending forming are arranged on the back face of a stamping mechanism, and after the stamping mechanism completes stamping work and resets, the telescopic die core is automatically driven by the connecting rod mechanism to stretch out to press a workpiece to match a movable die to bend the workpiece again, therefore, one-time forming of workpiece manufacturing is achieved, production efficiency is improved, and procedure integration is high.

Description

technical field [0001] The invention relates to the technical field of manufacturing semiconductor components, in particular to an automatic heating and bending device. Background technique [0002] The bending device is mainly used for stamping, bending and forming of heated workpieces, and is an important equipment for the production of semiconductor parts. [0003] However, the existing bending equipment mostly uses flame heating to heat the workpiece. After heating, the cooling is too fast and the temperature is difficult to control, resulting in high brittleness of the workpiece and easy breakage during the bending process. On the other hand, the existing bending equipment has a single processing process, and a set of equipment can only realize the processing of one process, and the process integration is low. [0004] Therefore, in view of the above problems, it is necessary to propose a bending equipment with controllable heating temperature and high process integrat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D7/06B21D7/16B21D43/00
CPCB21D7/06B21D7/16B21D7/162B21D43/003
Inventor 袁大飞刘同武黎静
Owner 江苏实为半导体科技有限公司
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