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A kind of article with multi-scale holes and its preparation method and application

A multi-scale, hole technology, applied in the direction of manufacturing tools, additive manufacturing, manufacturing auxiliary devices, etc., to achieve the effect of increasing the size of the hole, stabilizing the structure of the hole, and eliminating stress

Active Publication Date: 2021-11-05
FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For polymer parts processed by 3D printing, the improvement of strength mainly depends on the selection or modification of the polymer material itself (chemical modification or reinforcing agent blending modification, etc.), how to realize its structure through the structural change of the part. The improvement of strength, especially impact resistance, etc. is a completely new field of research, and there are few related reports so far

Method used

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  • A kind of article with multi-scale holes and its preparation method and application
  • A kind of article with multi-scale holes and its preparation method and application
  • A kind of article with multi-scale holes and its preparation method and application

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preparation example Construction

[0038] The preparation method of the present invention will be further described in detail in conjunction with specific examples below. It should be understood that the following examples are only for illustrating and explaining the present invention, and should not be construed as limiting the protection scope of the present invention. All technologies realized based on the above contents of the present invention are covered within the scope of protection intended by the present invention.

[0039] The experimental methods used in the following examples are conventional methods unless otherwise specified; the reagents and materials used in the following examples can be obtained from commercial sources unless otherwise specified.

[0040] The ABS material used in the following examples was purchased from Chi Mei Company's ABS material with a brand name of PA-716.

[0041] The 3D printer used in the following embodiments is a 3D printer based on FDM, and its structure is such ...

Embodiment 1

[0049] ABS material is used for 3D printing, and the printing parameters are: printing temperature 230°C, filling rate 80%, printing speed 50mm / s. During the printing process, two identical acoustic wave generators are placed on both sides of the deposition platform, face to face, and the distance apart is an integer multiple of half wavelength, for example, 28 cm, so as to form a standing acoustic wave. The sound wave frequency is 20kHz and the power is 100W.

[0050] Prepare the cantilever beam impact test sample according to ISO180-1A, prepare the sound absorption performance test sample according to ISO11654-1997, the sample size is 100mm long, 100mm wide, and 2mm thick; the sample size used to test the porosity is 20mm long, 20mm wide, Thickness 4mm.

Embodiment 2

[0052] ABS material is used for 3D printing, and the printing parameters are: printing temperature 230°C, filling rate 80%, printing speed 50mm / s. During the printing process, two identical acoustic wave generators are placed on both sides of the deposition platform, face to face, and the distance apart is an integer multiple of half wavelength, for example, 28 cm, so as to form a standing acoustic wave. The sound wave frequency is 20kHz and the power is 100W. After printing, the parts were immersed in an acetone / methanol solution with a mass ratio of 15:2 for 30 minutes, and then dried with a blower.

[0053] Prepare the cantilever beam impact test sample according to ISO180-1A, prepare the sound absorption performance test sample according to ISO11654-1997, the sample size is 100mm long, 100mm wide, and 2mm thick; the sample size used to test the porosity is 20mm long, 20mm wide, Thickness 4mm.

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Abstract

The invention provides a product with multi-scale holes, its preparation method and application. The article with multi-scale holes is produced by 3D printing; wherein, the article includes multi-scale holes, and the multi-scale holes include holes formed by adjacent deposition lines and holes inside the deposition lines. Among them, the hole size can be adjusted by adjusting the printing parameters, the frequency and power of the sound wave, and then realize the regulation of the macroscopic mechanical properties and sound absorption properties. In addition, the present invention can eliminate the stress of the polymer molecules around the holes by immersing the entire printed product in a corresponding solvent, further stabilize the hole structure, and increase the size of the holes.

Description

technical field [0001] The invention relates to a workpiece with multi-scale holes and its preparation method and application, in particular to a method for preparing a multi-scale hole workpiece by FDM-based 3D printing assisted by acoustic waves, which belongs to the field of advanced manufacturing. Background technique [0002] With the continuous development of the polymer industry, higher and newer requirements are put forward for the processing technology. The traditional idea of ​​improving the process, such as increasing the length-to-diameter ratio of the screw and the mechanical size of the overall equipment, can no longer meet the requirements of rapid development. Therefore, Polymer processing requires the development of new ideas. [0003] 3D printing, also known as Additive Manufacturing (AM), appeared in the 1970s. According to the definition given by the American Association for Testing and Materials International Standard Organization F42 Additive Manufactu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C64/118B29C64/314B29C64/393B33Y10/00B33Y50/02B33Y80/00
CPCB33Y10/00B33Y50/02B33Y80/00B29C64/118B29C64/314B29C64/393
Inventor 王剑磊王西柚吴立新
Owner FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI