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A dual-circulation heat dissipation system

A cooling system, dual-circulation technology, applied in cooling/ventilation/heating transformation, modification by conduction heat transfer, electrical components, etc. Uneven distribution, etc.

Active Publication Date: 2021-03-19
SHENZHEN AUTOMOTIVE RES INST BEIJING INST OF TECH (SHENZHEN RES INST OF NAT ENG LAB FOR ELECTRIC VEHICLES)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] As we all know, the current heat dissipation schemes for power modules such as DC-DC voltage converters and AC-DC converters mainly include air-cooled heat dissipation systems and water-cooled heat dissipation systems. The heat dissipation teeth of the housing or fixed on one side of the power supply housing, the heat generated inside the power supply is transferred to the power supply housing in the form of heat radiation and heat conduction, and the fan is used for forced convection to dissipate the heat; air cooling The disadvantage of the heat dissipation system is that due to the influence of factors such as high internal temperature of the power supply, uneven temperature distribution, and no flow of air inside the power supply, the heat dissipation efficiency of the air-cooled heat dissipation system is low, and most of them are only suitable for power supplies with a power of no more than 100KW.
The water-cooling heat dissipation system uses the water pipes arranged inside or outside the power supply to complete heat exchange with the power supply through the flow effect of water, thereby realizing the cooling and heat dissipation of the power supply. Although compared with the air-cooled heat dissipation system, its heat dissipation efficiency is higher and can be It is suitable for power supplies with a power exceeding 100KW, but due to the need to arrange water pipes, it is easy to increase the structural complexity of the cooling system and the power supply itself; at the same time, affected by factors such as system processing and manufacturing technology, the production and use costs of the water cooling system are relatively high. High, and once a sealing problem occurs, such as water leakage, it is easy to cause damage to the entire cooling system and even the power supply

Method used

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  • A dual-circulation heat dissipation system
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  • A dual-circulation heat dissipation system

Examples

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Embodiment 1

[0040] see Figure 1 to Figure 5 as well as Figure 8 , A dual-circulation heat dissipation system provided in Embodiment 1 includes a box body 10, a built-in fan 20, an external fan 30, and a heat insulating member 50, which will be described separately below.

[0041]The box body 10 is used to provide an assembly space for the heat source module A. It is mainly composed of the heat dissipation cover 11, the heat conduction cover 12 and the bottom case 13, which are sequentially assembled in the form of layer-by-layer distribution, and then locked and formed by hardware connectors such as screws. Thus, the box body 10 forms a hollow cuboid structure, a first space a is formed between the bottom case 13 and the heat conduction cover 12, and a second space b is formed between the heat dissipation cover 11 and the heat conduction cover 12; in this embodiment, The heat dissipation cover 11 and the heat conduction cover 12 can use metal materials such as copper and aluminum with ...

Embodiment 2

[0061] see Image 6 , Figure 7 , Figure 8 with Figure 9 , the present embodiment provides a dual-circulation heat dissipation system, and its difference from the first embodiment is that the heat insulating member 50 is omitted.

[0062] By omitting the heat insulator 50, the box body 10 can be assembled into the box body 10 directly by using the heat dissipation cover 11, the heat conduction cover 12 and the bottom shell 13 in the form of layer-by-layer distribution. The second space b between them and the first space a formed between the heat conduction cover 12 and the bottom case 13 are space-divided, that is, the first space a is equivalent to an independent first chamber a2, and the second space b is equivalent to In an independent second chamber a1, it can also be understood that the box body 10 has only one chamber unit group at this time, and the heat source module A is assembled in the first chamber a2, and the external fan 30 and the built-in fan can also be u...

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Abstract

A dual-circulation heat dissipation system, including a box body, a built-in fan and an external fan, the box body has a second space, a first air port, a second air port and a first space for accommodating a heat source module, the first space passes through the first air port It communicates with the second air outlet to the second space; the built-in fan is arranged in the first space, and the blowing end of the built-in fan is connected to the first air outlet; the external fan is arranged on the outer wall of the box adjacent to the second space. The air flow in the box is strengthened by the built-in fan to form a turbulence effect in the box, and the heat exchange with the heat source module is completed during the air flow to realize the internal circulation cooling effect of the heat source module; The air in the space environment where the body is located flows, and through the forced convection effect, the air in the environment space completes the heat exchange with the box body during the flow process, thereby dissipating heat quickly into the environment space; its heat dissipation efficiency is high, and it can take into account And meet different heat dissipation requirements.

Description

technical field [0001] The invention relates to the technical field of power supply heat dissipation, in particular to a double-cycle heat dissipation system. Background technique [0002] As we all know, the current heat dissipation schemes for power modules such as DC-DC voltage converters and AC-DC converters mainly include air-cooled heat dissipation systems and water-cooled heat dissipation systems. The heat dissipation teeth of the housing or fixed on one side of the power supply housing, the heat generated inside the power supply is transferred to the power supply housing in the form of heat radiation and heat conduction, and the fan is used for forced convection to dissipate the heat; air cooling The disadvantage of the heat dissipation system is that due to the influence of factors such as high internal temperature of the power supply, uneven temperature distribution, and no flow of air inside the power supply, the heat dissipation efficiency of the air-cooled heat ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20145H05K7/20172H05K7/20209H05K7/2039H05K7/20409
Inventor 王文伟吴磊
Owner SHENZHEN AUTOMOTIVE RES INST BEIJING INST OF TECH (SHENZHEN RES INST OF NAT ENG LAB FOR ELECTRIC VEHICLES)