Voltage regulator ceramic tube shell, packaging structure and manufacturing methods of voltage regulator ceramic tube shell and packaging structure

Abstract

The invention belongs to the field of integrated circuits and relates to a voltage regulator ceramic tube shell, a packaging structure and manufacturing methods of the voltage regulator ceramic tube shell and the packaging structure. In order to achieve the purpose of improving the output voltage precision of a voltage regulator, a power output pin is of a double-key bonding finger structure, anda bonding pad at the back of the power output pin is connected with a first bonding finger and a second bonding finger; the back bonding pad is connected with the first bonding finger and the second bonding finger through two independent wiring channels in the multilayer ceramic tube shell; the first bonding finger is bonded with the drain electrode output end of a power tube in the voltage regulator through a first binding wire; the second bonding finger is bonded with the sampling end of a first feedback sampling resistor through a second binding wire. Compared with a common ceramic tube shell and packaging structure, the voltage regulator ceramic tube shell and the packaging structure circuit can effectively reduce loss on a path for outputting large current, eliminate the influence ofparasitic resistance RC of the ceramic tube shell on the load regulation rate of the voltage regulator, and improve the output voltage precision of the voltage regulator .

Description

technical field [0001] The invention belongs to the technical field of packaging of analog integrated circuits, in particular to a voltage regulator ceramic shell for improving the output voltage precision of the voltage regulator, a packaging structure and a manufacturing method thereof. Background technique [0002] The main packaging forms of integrated circuits include plastic packaging, ceramic packaging, metal packaging, etc. At present, plastic packaging is the most widely used, and plastic packaging is non-hermetic packaging, which is widely used in consumer, communication, and industrial fields. However, in some high-reliability applications, it is necessary to use hermetic packaging components, prohibit the use of plastic packaging components, and require ceramic packaging or metal packaging to replace plastic packaging. The ceramic package is mainly composed of a ceramic shell, chip, bonding wire and cover plate. [0003] At present, the common ceramic package st...

AI Technical Summary

Problems solved by technology

The parasitic resistance of the ceramic shell is an order of magnitude larger than the parasitic resistance of the frame of the plastic package. When the ceramic package replaces the plastic package, it will have a great impact on the load regulation rate of the voltage regulator.

Due to the limitation of paste material and wiring width, the parasitic resistance R of the ceramic shell C Usually it is about 50mΩ. For a chip such as a voltage regulator, when the load current is 1A, the load regulation change introduced by the package parasitic resistance is 50mV. When the load current is 2A, the load introduced by the package parasitic resistance The variation of the adjustment rate is 100mV. If the load current is larger, it will have a greater impact on the parameters of the load adjustment rate, which will greatly reduce the output voltage accuracy of the voltage regulator.

Therefore, it is necessary to adopt a new ceramic shell package structure design to reduce the influence of the parasitic resistance of the ordinary ceramic shell on the load regulation parameter of the voltage regulator, and to solve the problem of the drop in output voltage accuracy of the voltage regulator due to the use of the ordinary ceramic shell.

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