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Soldering conductor to aluminum layer

A technology of aluminum layer and conductor, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc.

Pending Publication Date: 2021-02-02
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, soldering on Al surfaces is currently limited to applications outside of semiconductor device fabrication techniques

Method used

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  • Soldering conductor to aluminum layer
  • Soldering conductor to aluminum layer
  • Soldering conductor to aluminum layer

Examples

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example 1

[0076] Example 1 is an apparatus in which a conductor is soldered to an aluminum layer, the apparatus comprising: a substrate; an aluminum layer disposed over the substrate; aluminum forming an aluminum layer of a first bonding metal; disposed over the aluminum layer an intermetallic compound layer; a solder layer disposed on the intermetallic compound layer, the solder of the solder layer comprising a low-melting main component; and a conductor disposed on the solder layer, the conductor having a structure comprising a second bonding metal wherein the intermetallic compound of the intermetallic compound layer includes aluminum and a second bonding metal, and is substantially free of low-melting point main components.

[0077] In Example 2, the subject matter of Example 1 may optionally include: wherein the low melting point main component is Pb, Sn, Bi, Ga or In.

[0078] In Example 3, the subject matter of Example 1 or 2 can optionally include: wherein the second binding met...

example 14

[0089] Example 14 is a method of soldering a conductor to an aluminum layer on a substrate, the method comprising: at least partially removing the aluminum oxide layer covering the aluminum layer; applying a protective layer over the aluminum layer to prevent the aluminum oxide layer from regenerating on the aluminum layer; placing solder between the protective layer and the conductor, wherein the solder includes a low-melting primary component and the conductor has a soldering surface that includes a second bonding metal; and soldering by heating the device to temperature to melt the low melting point main component to at least partially dissolve the protective layer in the molten solder and transport the second bonding metal from the soldering surface to the aluminum layer and to form an intermetallic compound layer on the aluminum layer, thereby The conductor is soldered to the aluminum layer, wherein the intermetallic compound of the intermetallic compound layer includes al...

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Abstract

An arrangement of a conductor and an aluminum layer soldered together comprises a substrate and the aluminum layer disposed over the substrate. The aluminum forms a first bond metal. An intermetalliccompound layer is disposed over the aluminum layer. A solder layer is disposed over the intermetallic compound layer, wherein the solder comprises a low melting majority component. The conductor is disposed over the solder layer, wherein the conductor has a soldering surface which comprises a second bond metal. The intermetallic compound comprises aluminum and the second bond metal and is predominantly free of the low melting majority component.

Description

technical field [0001] The present disclosure relates generally to soldering techniques in semiconductor device fabrication, and more particularly to aspects of soldering conductors to aluminum layers. Background technique [0002] Soldering processes are widely used in semiconductor device manufacturing for various purposes including chip bonding, wire / clip / tape bonding, device mounting, and the like. A variety of solder materials, fluxes and soldering techniques are available. Soldering methods and soldering substances can have a large impact on the cost, yield, performance and reliability of semiconductor devices. [0003] While wire bonding on aluminum (Al) is a widely established process, soldering on aluminum surfaces requires the application of highly reactive chemicals (fluxes) to remove the highly stable Al on Al 2 O 3 Floor. This highly reactive chemical is incompatible with standard semiconductor manufacturing processes. Therefore, soldering on Al surfaces is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L21/58
CPCH01L23/488H01L24/80H01L2224/80001H01L2224/80801H01L2224/8083H01L2924/014H01L24/29H01L24/32H01L2224/04026H01L2224/32245H01L2224/83447H01L2224/291H01L2924/00015H01L2224/29116H01L2224/29111H01L2224/29113H01L2224/29109H01L24/83H01L2224/8381H01L2224/32503H01L2224/32507H01L2224/83815H01L2224/83825H01L2224/05618H01L2224/05124H01L2224/05686H01L2224/27849H01L2224/03828H01L2224/0382H01L2224/038H01L2224/035H01L24/03H01L24/05H01L2224/05073H01L2224/05082H01L24/27H01L2224/05118H01L2224/83438H01L2224/83455H01L2224/29105H01L2224/83472H01L2224/83444H01L2224/83464H01L2224/83423H01L2224/8346H01L2224/05624H01L2224/05647H01L2224/83439H01L2224/83418H01L2224/83471H01L2224/83469H01L2224/83449H01L2224/05623H01L2224/05638H01L2224/05666H01L2924/00014H01L2224/29118H01L2924/01047H01L2924/0105H01L2924/01051H01L2924/01048H01L2924/00012H01L2924/0542H01L2924/0103H01L2924/05432H01L2924/0583H01L2924/01013H01L2924/059H01L2924/01014H01L2924/01029H01L2924/013H01L2924/01046H01L2924/01049H01L2924/01012H01L2924/01079H01L2924/01078H01L2924/01015H01L2924/01028H01L2924/01083H01L2924/01022H01L2924/01031H01L29/45H01L2924/01327H01L2224/29139H01L2224/2912H01L2224/29147H01L2224/83493H01L2224/83486H01L2224/83191H01L2224/83022H01L2224/8302
Inventor A·海因里希R·奥特伦巴S·施瓦布
Owner INFINEON TECH AG