Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Leveling device in semiconductor heat treatment equipment and semiconductor heat treatment equipment

A technology of heat treatment equipment and leveling device, which is applied in lighting and heating equipment, semiconductor/solid-state device manufacturing, furnaces, etc., and can solve failure, small diameter of connecting bolts, and unsynchronized screwing of multiple connecting bolts. and other problems to achieve the effect of reducing the probability of failure, improving the sealing stability and improving the stability of use

Active Publication Date: 2021-02-05
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the long length and small diameter of the connecting bolts, when installing the existing leveling device, the compression spring needs to be pre-compressed while screwing in the connecting bolts, which will bring greater resistance to the screwing in of the connecting bolts , it will cause the connecting bolts to be stuck or bent due to excessive screwing torque or asynchronous screwing of multiple connecting bolts, which has high requirements for installation and makes installation difficult
Moreover, when using the existing leveling device, when the compression degree of multiple compression springs is uneven, radial thrust will be generated on each connecting bolt, which will cause bending deformation of the connecting bolts in the long run, making the adjustment of the leveling device difficult. The flat function is affected or even fails, causing the process gate and the process chamber to not be completely sealed, resulting in the failure of the semiconductor process to proceed normally

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Leveling device in semiconductor heat treatment equipment and semiconductor heat treatment equipment
  • Leveling device in semiconductor heat treatment equipment and semiconductor heat treatment equipment
  • Leveling device in semiconductor heat treatment equipment and semiconductor heat treatment equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036]In order for those skilled in the art to better understand the technical solution of the present invention, the leveling device and the semiconductor heat treatment equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0037] Such as figure 1 As shown, this embodiment provides a leveling device 1 in semiconductor heat treatment equipment, which is used to level the process door assembly in semiconductor heat treatment equipment. 1 includes an elastic member 11, a first connecting piece 12 and a second connecting piece 13, wherein the first connecting piece 12 is provided with a first receiving groove 121, and the first connecting piece 12 is connected to one of the sealing door 18 and the supporting part 19 Connection; the second connecting member 13 is provided with a second receiving groove 131, and the second receiving groove 131 is arranged opposite to the first receiving groove 121, and the secon...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a leveling device in semiconductor heat treatment equipment and the semiconductor heat treatment equipment. The leveling device comprises an elastic component, a first connecting part and a second connecting part; the first connecting part is connected with one of a sealing door and a supporting part, and a first accommodating groove is formed in the first connecting part; the second connecting part is connected with the other one of the sealing door and the supporting part; a second accommodating groove opposite to the first accommodating groove is formed in the secondconnecting part; the first connecting part and the second connecting part are connected in a clamped mode and can relatively move in the elastic deformation direction of the elastic component during clamping; and the elastic component is arranged in a containing space defined by the first containing groove and the second containing groove in a matched mode. According to the leveling device in thesemiconductor heat treatment equipment and the semiconductor heat treatment equipment provided, the mounting difficulty of the leveling device can be reduced, the failure probability of the leveling device is reduced, and the use stability of the leveling device is improved, so that the sealing stability of a process door assembly is improved, and the stability of a semiconductor heat treatment process is improved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor equipment, in particular to a leveling device in semiconductor heat treatment equipment and semiconductor heat treatment equipment. Background technique [0002] The process door of the semiconductor vertical furnace equipment is not only used to contact and seal the process chamber during the process, so as to ensure the sealing requirements of the semiconductor process, but also has a crystal boat for carrying wafers installed on it. The wafer to be processed is transferred to the process chamber for processing, or the processed wafer is transferred out of the process chamber to be taken away. However, due to assembly and processing errors, there will inevitably be certain errors in the levelness of the two surfaces where the process door and the process chamber are in contact with each other, resulting in some gaps between the process door and the process chamber. Completely seal...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): F27D1/18H01L21/67
CPCF27D1/1858H01L21/67098
Inventor 黄敏涛
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products