Leveling device in semiconductor heat treatment equipment and semiconductor heat treatment equipment
A technology of heat treatment equipment and leveling device, which is applied in lighting and heating equipment, semiconductor/solid-state device manufacturing, furnaces, etc., and can solve failure, small diameter of connecting bolts, and unsynchronized screwing of multiple connecting bolts. and other problems to achieve the effect of reducing the probability of failure, improving the sealing stability and improving the stability of use
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0036]In order to enable those skilled in the art to better understand the technical solutions of the present invention, the leveling device and semiconductor heat treatment equipment in the semiconductor heat treatment equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0037]Such asfigure 1 As shown, this embodiment provides a leveling device 1 in a semiconductor heat treatment equipment for leveling a process door assembly in a semiconductor heat treatment equipment. The process door assembly includes a sealing door 18 and a supporting portion 19 disposed oppositely, and the leveling device 1 includes an elastic component 11, a first connecting piece 12 and a second connecting piece 13, wherein a first receiving groove 121 is provided in the first connecting piece 12, and the first connecting piece 12 is connected to one of the sealing door 18 and the supporting portion 19 The second connecting member 13 is pro...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap