Silicon rod splicing device capable of splicing cylindrical silicon rods

Abstract

The invention relates to the field of silicon rods, in particular to a silicon rod splicing device capable of splicing cylindrical silicon rods. The invention aims to provide the silicon rod splicingdevice capable of splicing cylindrical silicon rods. According to a technical scheme in the invention, the silicon rod splicing device capable of splicing the cylindrical silicon rods comprises a bottom frame, a feeding unit, a winding unit, an agent injection unit and a control screen, wherein the bottom frame is connected with the feeding unit, the bottom frame is connected with the winding unit; the bottom frame is connected with the agent injection unit; the bottom frame is connected with the control screen; and the feeding unit is connected with the winding unit. According to the siliconrod splicing device, cuboid-shaped and cylindrical silicon rods can be automatically spliced.

Description

technical field [0001] The invention relates to the field of silicon rods, in particular to a silicon rod splicing device capable of splicing cylindrical silicon rods. Background technique [0002] In the manufacture of solar photovoltaic cells, cutting monocrystalline silicon rods or polycrystalline silicon rods into silicon wafers is one of the most critical processes. Due to the high cutting efficiency and cutting accuracy of diamond wire saws, the cutting method of silicon wafers is being replaced by traditional mortar. The cutting method is changed to the diamond wire saw cutting method. [0003] Chinese patent CN108177260A aims at the cutting of the existing sub-wire net because the wire net cannot be distributed to the end of the ingot, so that each short rod has a thick slice of about 2 mm at both ends, resulting in a decrease in the chip output rate of the ingot and resulting in production capacity. For the problem of waste, a method and device for diamond wire cut...

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the fact that the wire mesh cannot be distributed to the end of the ingot when the wire mesh is cut in the prior art, each short rod has a thickness of about 2 mm at both ends, resulting in a decrease in the chip output rate of the ingot and resulting in waste of production capacity , the existing method can only splice cuboid silicon rods and there is no automatic mechanical device. If the splicing is done manually, the cylindrical silicon rods cannot be spliced, and the splicing efficiency is low. Technical problem: provide a A silicon rod splicing device capable of splicing cylindrical silicon rods

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