System and method for scanning a sample using multi-beam inspection apparatus
A technology for configuring systems and samples, applied in circuits, discharge tubes, electrical components, etc., to solve problems such as trouble
Pending Publication Date: 2021-02-09
ASML NETHERLANDS BV
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Problems solved by technology
For example, uninvited particles can be troublesome for patterns with smaller critical feature sizes that have been adopted to meet the ever-increasing performance requirements of IC chips
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[0044] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings, wherein the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations set forth in the following description of the exemplary embodiments do not represent all implementations consistent with the invention. Rather, they are merely examples of apparatus and methods consistent with aspects related to the invention as set forth in the appended claims.
[0045] Electronic devices consist of circuits formed on a single piece of silicon called a substrate. Many circuits can be formed together on the same single piece of silicon and are called an integrated circuit or IC. The size of these circuits has been greatly reduced so that more circuits can fit on the substrate. For example, an IC chip in a smartphone can be as sm...
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An improved system and method for inspection of a sample using a particle beam inspection apparatus, and more particularly, to systems and methods of scanning a sample with a plurality of charged particle beams. An improved method of scanning an area of a sample using N charged particle beams, wherein N is an integer greater than or equal to two, and wherein the area of the sample comprises a plurality of scan sections of N consecutive scan lines, includes moving the sample in a first direction. The method also includes scanning, with a first charged particle beam of the N charged particle beams, first scan lines of at least some scan sections of the plurality of scan sections moving towards a probe spot of the first charged particle beam. The method further includes scanning, with a second charged particle beam of the N charged particle beams, second scan lines of at least some scan sections of the plurality of scan sections moving towards a probe spot of the second charged particle beam. In addition, there is provided a multi-beam tool comprising: a beam configuration system including a charged-particle source for generating a primary beam of charged particles, a stage configuredto hold a sample, and a deflector system between the charged-particle source and the stage configured to split the primary beam into an array of beams, wherein the beam configuration system is configured to provide a rotated beam configuration with a rotation angle determined based on a number of beams in a row of the array of beams.
Description
[0001] Cross References to Related Applications [0002] This application claims priority to U.S. Application 62 / 684,138, filed June 12, 2018, U.S. Application 62 / 787,227, filed December 31, 2018, and U.S. Application 62 / 850,461, filed May 20, 2019 , the entire contents of which are hereby incorporated by reference. technical field [0003] Embodiments provided herein relate generally to inspection of samples using particle beam inspection devices, and more particularly, to systems and methods for scanning samples with multiple charged particle beams. Background technique [0004] When manufacturing semiconductor integrated circuit (IC) chips, pattern defects or unwanted particles (residue) inevitably appear on wafers or masks during the manufacturing process, thereby reducing yield. For example, uninvited particles can be troublesome for patterns with smaller critical feature sizes that have been adopted to meet the ever-increasing performance requirements of IC chips. ...
Claims
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IPC IPC(8): H01J37/26H01J37/28
CPCH01J37/265H01J37/28H01J2237/1505H01J2237/24592H01J2237/2817H01J37/1474H01J37/222
Inventor M·G·M·J·玛森J·J·奥腾斯祃龙蒋友飞尹炜华李韦德刘学东
Owner ASML NETHERLANDS BV