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Liquid metal heat conduction paste and preparation method and application thereof

A technology of liquid metal and thermal paste, which is applied in the direction of chemical instruments and methods, heat exchange materials, etc., can solve the problems of lower thermal conductivity, easy oxidation, difficulty in viscosity control, etc., and achieve the effect of uniform composition and good thermal conductivity

Inactive Publication Date: 2021-02-12
湖南中材盛特新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among the existing liquid metal heat conduction pastes: some are semi-solid all-metal heat conduction pastes, which are easy to oxidize during the stirring process, which will significantly reduce the thermal conductivity and make it difficult to control the viscosity; will reduce thermal conductivity

Method used

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  • Liquid metal heat conduction paste and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A liquid metal heat conduction paste and a preparation method thereof, the ingredients include: gallium 60wt.%, indium 24wt.%, tin 15wt.%, zinc 1wt.%. The preparation method is as follows:

[0029] 1) Weigh metal gallium, indium, and tin according to the ratio of raw materials, and put them into the crucible;

[0030] 2) Put the crucible into the vacuum induction furnace, evacuate to 0.5Pa, and raise the temperature to 200°C;

[0031] 3) After gallium, indium and tin are melted, cool to room temperature to obtain gallium indium tin liquid metal;

[0032] 4) Weigh gallium indium tin liquid metal and zinc powder in proportion, put them into a nylon ball mill tank, and add an appropriate amount of nylon balls, the volume ratio of liquid metal to nylon balls is 1:2;

[0033] 5) Set the rotation speed at 300 r / min, and stir for 50 minutes to obtain an all-metal thermal paste.

[0034] The obtained thermal paste has a thermal conductivity of 25 w / (m·K) and a viscosity of 2...

Embodiment 2

[0036] A liquid metal heat conduction paste and a preparation method thereof, the ingredients include: gallium 60wt.%, indium 23wt.%, tin 14wt.%, zinc 2wt.%, silver 1%. The preparation method is as follows:

[0037] 1) Weigh metal gallium, indium, and tin according to the ratio of raw materials, and put them into the crucible;

[0038] 2) Put the crucible into the vacuum induction furnace, evacuate to 0.5Pa, and raise the temperature to 200°C;

[0039] 3) After gallium, indium and tin are melted, cool to room temperature to obtain gallium indium tin liquid metal;

[0040] 4) Weigh gallium indium tin liquid metal and zinc powder in proportion, put them into a nylon ball mill tank, and add an appropriate amount of nylon balls, the volume ratio of liquid metal to nylon balls is 1:2;

[0041] 5) Set the rotation speed at 500 r / min, and stir for 40 minutes to obtain an all-metal thermal paste.

[0042] The obtained thermal paste has a thermal conductivity of 28 w / (m·K) and a vis...

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Abstract

The invention provides liquid metal heat conduction paste and a preparation method and application thereof. The metal heat conduction paste comprises the following components in parts by weight: 40-60parts of gallium, 20-25 parts of indium, 10-15 parts of tin, 2-5 parts of zinc and 0-1 part of silver. The heat conduction paste is all-metal, is not oxidized in the smelting and stirring process, and has good thermal conductivity; the viscosity of the heat conduction paste can be adjusted through the proportion of the added powder; a planetary ball mill is adopted for stirring, no dead angle exists in the stirring process, and heat conduction paste components are uniform.

Description

technical field [0001] The invention belongs to the field of heat-conducting materials, and in particular relates to a liquid metal heat-conducting paste and a preparation method and application thereof. Background technique [0002] The surface of the electronic device and the heat sink is uneven. After being directly installed together, the actual contact area between the two is only about 10%-20% of the area of ​​the heat sink base, and the rest is the air gap. Since air conducts heat very poorly, the effectiveness of the heat sink is significantly reduced. Ordinary thermal conductive silicone grease can be filled in the gap between the electronic heating device and the heat sink to remove the air, reduce the contact thermal resistance, and improve the heat transfer performance. However, due to the small thermal conductivity of thermal conductive silicone grease, the improvement of heat transfer performance is very limited. [0003] Liquid metal thermal paste is mainly ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/12C22C28/00B22F9/04
CPCB22F9/04B22F2009/043C09K5/12C22C28/00
Inventor 谭锴颜新奇
Owner 湖南中材盛特新材料科技有限公司
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