Vacuum vapor phase cleaning jig and method for thick-film deep-cavity hybrid integrated circuit

Abstract

The invention discloses a vacuum vapor phase cleaning jig and method for a thick-film deep-cavity hybrid integrated circuit. The main body structure of the jig is a cuboid, two side frames of the cleaning jig are fixedly connected through a plurality of parallel cross beams, and the cross beams are distributed at the upper end and the lower end of the cleaning jig; the upper surfaces of the crossbeams above the jig are flush, a supporting strip is arranged between the two cross beams, the two ends of the supporting strip are fixedly connected to the two side frames of the cleaning jig in a lap joint mode, the upper surface of the supporting strip is flush with the upper surfaces of the cross beams, and through holes are formed in the supporting strip. During cleaning, a circuit is fixed to the supporting strip firstly and then fixed into the cleaning cavity, modified alcohol is added into a vacuum vapor phase cleaning machine for first-time steam rinsing, immersion cleaning, spray cleaning, second-time steam rinsing and vacuum drying, a cleaning agent is completely immersed into all parts of the thick-film deep-cavity hybrid integrated circuit, and a good cleaning effect is achieved.

Description

technical field [0001] The invention belongs to the technical field of non-destructive cleaning of electronic components, in particular to a vacuum vapor phase cleaning fixture and method for a thick-film deep-cavity hybrid integrated circuit. Background technique [0002] With the continuous improvement of miniaturization, light weight and high reliability requirements of my country's aerospace products, thick-film deep-cavity hybrid integrated circuits are gradually replacing traditional electronic products based on printed boards. Thick-film deep-cavity hybrid integrated circuits should adopt MCM technology with bare chip packaging as the core. MCM technology uses high-density interconnection technology to connect bare chips, shorten the wire bonding strength, and realize the light weight of aerospace electronic products. Quantification and miniaturization requirements. [0003] Various pollutants remain on the circuit during assembly of the thick-film deep-cavity hybrid...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems existing in the prior art, the present invention provides a vacuum vapor phase cleaning jig and method for a thick-film deep-cavity hybrid integrated circuit, which solves the problem of inconvenient picking and placing of the existing fixture, and enables the thick-film deep-cavity hybrid integrated circuit to achieve good cleaning effect

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