Semiconductor transistor die bonding auxiliary equipment

Abstract

The invention discloses semiconductor transistor die bonding auxiliary equipment, and the equipment structurally comprises a conveyor, a discharging groove, a support table, a carrying table, an equipment box, a controller and a die bonding head. The right end of the conveyor is movably matched with the discharging groove, the support table is fixed to the bottom end of the discharging groove through bolts, the carrying table is in clearance fit with the left side of the support table, and the carrying table is movably matched with the two sides of the conveyor; the carrying table is fixedly connected with the left side of the equipment box in an embedded mode, the controller is fixed to the upper surface of the carrying table and connected with the carrying table in an embedded mode, thedie bonding head is connected with a bolt on the upper surface of the carrying table, and the conveyor is movably matched with the top end of the die bonding head. The conveyor comprises a conveying belt, an air supply frame, a fixed plate, a limiting block and a supporting base. A transistor needing chip mounting is effectively fixed through the storage groove in the conveying belt, it is guaranteed that when the chip mounting head carries out chip mounting, the phenomenon that displacement is generated due to the downward pressure of the chip mounting head, and consequently chip mounting dislocation is caused is avoided, and the problem that the chip mounting head which is aligned in advance pastes a chip obliquely, and consequently the precision of subsequent chip mounting is affected is effectively solved.

Description

technical field [0001] The invention relates to the field of transistors, in particular to an auxiliary device for bonding semiconductor transistors. Background technique [0002] Transistors are also called semiconductor transistors. Semiconductors are a kind of material whose conductivity is between conductors and insulators. At present, most of the materials used to make semiconductors are silicon and germanium. Because this substance has a crystal structure, it is called is a semiconductor transistor; [0003] However, there are the following deficiencies in the prior art: the existing semiconductor transistor chip bonding auxiliary equipment needs to place the transistor on the conveyor belt and transfer it in during the assembly process of the existing semiconductor transistor chip bonding process, and the transistor transmission has a certain inertia during the chip bonding process. , the placement head exerts a downward pressure on it at the moment of placement, cau...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies in the prior art, the object of the present invention is to provide an auxiliary device for bonding semiconductor transistors to solve the problem of placing the transistor on It is passed on the conveyor belt, and in the process of placement, the transmission of the transistor has a certain inertia, and the placement head exerts a downward pressure on it at the moment of placement, causing the transistor to be displaced on the conveyor belt to a certain extent, resulting in the advance. A good patch head will stick the patch to the wrong side, which will affect the accuracy of the subsequent patch

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