[0018]The present invention will be further described below in conjunction with the description of the drawings and the specific embodiments.
[0019]Such asFigure 1 to Figure 2As shown, a heating protection nozzle for a wafer rework machine includes a microporous nozzle 3 with a guide groove, a temperature sensor 10, a heating device 8 and a protective gas circulation device, the temperature sensor 10, the heating device 8. The protective gas circulation device is respectively fixed on the microporous suction nozzle 3 with diversion groove, and the microporous suction nozzle 3 with diversion groove is divided into a head 301, a body 302 and a tail 303 from bottom to top. The head of the microporous suction nozzle 3 with a diversion groove is provided with an adsorption hole 304 for adsorbing crystal elements, and the temperature sensor 10 is located at the head 301 of the microporous suction nozzle 3 with a diversion groove.
[0020]The microporous suction nozzle 3 with diversion groove is connected with an outer ring heat insulation protective sleeve 9, and the microporous suction nozzle 3 with diversion groove and the outer ring heat insulation protective sleeve 9 are enclosed to form a heating cavity 13. The heating device 8 is located in the heating cavity 13.
[0021]The head 301 of the microporous suction nozzle 3 with a guide groove is provided with a spiral guide groove 11 for leading out the shielding gas, and the spiral guide groove 11 spirally extends from the inside of the heating cavity 13 to the outside. The spiral guide groove 11 is the protective gas outlet of the protective gas circulation device.
[0022]The head 301 of the microporous suction nozzle 3 with a diversion groove has a conical shape.
[0023]The protective gas circulation device includes an inner ring heat storage body 7, which is located between the microporous suction nozzle 3 with a diversion groove and the outer ring heat insulation protective sleeve 9, and the inner ring The heat storage body 7 and the microporous suction nozzle 3 with diversion grooves are enclosed to form a heat storage cavity 12, with the microporous suction nozzle 3 with diversion grooves as the center, and the heat storage cavity 12 is In the inner ring, the heating cavity 13 is an outer ring, the heat storage cavity 12 is provided with a shielding gas shunt inlet 5 for inputting shielding gas, and the inner ring heat storage body 7 is provided with a shielding gas heat exchange channel 6 , The protective gas heat exchange channel 6 communicates with the heat storage cavity 12 and the heating cavity 13, the protective gas branch inlet 5, the heat storage cavity 12, the protective gas heat exchange channel 6, the heating cavity 13, the protection The gas outlet is connected as a protective gas channel.
[0024]The shielding gas heat exchange channel 6 is arranged inclined upwards, and one end of the shielding gas heat exchange channel 6 located in the heat storage cavity 12 is a low end with a lower height, and one end located at the heating cavity 13 is a higher height. The high-end department.
[0025]The body 302 of the microporous suction nozzle 3 with diversion groove is located in the heat storage cavity 12.
[0026]The head 301 of the microporous suction nozzle 3 with a guide groove is located outside the heating cavity 13.
[0027]The upper end of the inner ring heat storage body 7 is provided with a shielding gas inlet 4 and a shielding gas splitting cavity 14 (there is no 14 in the figure, there are two 13), and the shielding gas splitting cavity 14 is annular, The shielding gas inlet 4 and the shielding gas branch inlet 5 are respectively connected to the shielding gas splitting cavity 14, the shielding gas inlet 4, the shielding gas splitting cavity 14, the shielding gas splitting inlet 5, and the heat storage cavity 12. The protective gas heat exchange channel 6, the heating chamber 13, and the protective gas outlet are connected to form a protective gas channel.
[0028]The shielding gas enters through the shielding gas inlet 4, passes through the shielding gas shunt inlet 5 and the shielding gas heat exchange channel 6, is heated to the set temperature in the heating chamber 13, and is output from the shielding gas outlet to take away the micropipette with the diversion groove. The heat of the hole suction nozzle 3 and the inner ring heat storage body 7 realizes heat exchange, so as to prevent the heat from being transmitted to the clamping device 2 along the microporous suction nozzle 3 with the guide groove. The protective gas heated to the set temperature is sent to the periphery of the crystal element to be replaced through the spiral guide groove 11 to protect the entire crystal exchange process from oxidation, thereby ensuring the reliability of the replacement crystal element.
[0029]The heating protection suction nozzle further includes a controller and a protection gas supply device, the protection gas supply device is connected to the protection gas inlet 4, and the controller is respectively connected to the temperature sensor 10 and the heating device 8. The sensor 10 detects the real-time temperature of the protective gas output port and feeds it back to the controller, and the controller controls the heating device 8 to heat. When the detected temperature reaches the set temperature, the heating device 8 stops working.
[0030]The heating protection suction nozzle also includes a clamping device 2 connected to the wafer rework machine, the tail 303 of the microporous suction nozzle 3 is wrapped with a heat insulation sleeve 1, and the clamping device 2 is clamped on the heat insulation Set on 1.
[0031]The entire heating protection nozzle is connected to the equipment (such as wafer rework machine) through the clamping device 2. A heat insulation sleeve 1 is provided between the clamping device 2 and the tail 303 of the microporous nozzle 3 with diversion groove to prevent The heat conducted by the microporous suction nozzle 3 is transferred to the clamping device 2, which can prevent the clamping device 2 from being deformed by heat.
[0032]The heating device 8 heats the entire suction nozzle according to the temperature set by the temperature control device 10, and the heating device 8 stops working when the detected temperature reaches the set temperature
[0033]The invention provides a heating protection nozzle for a wafer rework machine, which is suitable for wafer rework machines. When replacing wafers, it can be automatically and quickly heated to a set temperature and controlled at a constant temperature. It can be used in a constant temperature environment. The wafer is replaced under, and at the same time, the wafer welding can be protected against oxidation.
[0034]The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be considered that the specific implementation of the present invention is limited to these descriptions. For those of ordinary skill in the technical field to which the present invention belongs, a number of simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as belonging to the protection scope of the present invention.
