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Powder deposition

A powder and deposition head technology, applied in the direction of processing and manufacturing, coating devices, manufacturing tools, etc., can solve problems that affect the quality of molded parts

Inactive Publication Date: 2021-02-19
UNIV OF MANCHESTER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, variations in powder deposition rates can lead to defects, such as porosity, which can adversely affect the quality of molded parts

Method used

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Embodiment Construction

[0016]According to the present invention, there is provided a powder deposition head for additive manufacturing equipment as set forth in the appended claims. An additive manufacturing equipment and a method of controlling powder deposition are also provided. Other features of the invention will be apparent from the appended claims and the following description.

[0017]According to the first aspect, there is provided a powder deposition head for additive manufacturing equipment, which includes:

[0018]A hopper, the hopper being arranged to receive powder therein;

[0019]A nozzle, the nozzle having a passage therethrough that defines an axis and is in fluid communication with the hopper;

[0020]The first actuator, the first actuator is arranged to vibrate the powder in the hopper in use, and thereby at least partially control the powder in the hopper toward the nozzle Move; and

[0021]A second actuator, which is coupled to the nozzle and arranged to vibrate the nozzle at least partially along ...

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Abstract

A powder deposition head (100) for an additive manufacturing apparatus is described. The powder deposition head (100) comprises a hopper (110) arranged to receive a powder therein. The powder deposition head (100) comprises a nozzle (120), having a passageway (122) therethrough defining an axis A and in fluid communication with the hopper (110). The powder deposition head (100) comprises a first actuator (130) arranged to, in use, vibrate the powder in the hopper (110) and thereby control, at least in part, movement of the powder in the hopper (110) towards the nozzle (120). The powder deposition head (100) comprises a second actuator (140) coupled to the nozzle (120) and arranged to, in use, vibrate the nozzle (120), at least in part, along the axis A and thereby control, at least in part, movement of the powder from the hopper (110) through the passageway (122). In this way, the powder deposition head (100) deposits, in use, the powder at a relatively more constant (i.e. uniform) deposition rate.

Description

Technical field[0001]The invention relates to powder deposition for additive manufacturing.Background technique[0002]Complex and completely dense metal parts can be manufactured by selective laser melting (SLM) based on additive manufacturing by layer-by-layer powder bed melting. The SLM of metal materials is becoming mature. SLM of ceramic materials (such as silica, soda lime glass and alumina) is being developed. However, due to the use of powder bed spreading technology, SLM is usually limited to printing a single material in each layer. Multi-material SLM with multiple materials in each layer faces many challenges, including multiple material delivery, avoiding material contamination, material recycling, new software configuration considering multiple materials, different process parameters for different materials, and one material versus another The influence of different materials, and the interface between different materials. In a multi-material SLM, the material cannot be d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F10/28B22F12/53B22F12/52B22F10/30B22F10/36B22F10/34B22F10/43B22F12/00B29C64/153B29C64/255B29C64/209B33Y10/00B33Y30/00B33Y40/00B33Y70/10
CPCB33Y10/00B33Y30/00B29C64/153B22F2999/00C22C33/0292B33Y40/00B29C64/329B29C64/209B29C64/165Y02P10/25B22F10/28B22F10/38B22F12/53B22F10/40B22F12/52B22F10/36B22F10/366B22F10/60B22F2202/01B29C64/255
Inventor 李林韦超张小冀觉元慧
Owner UNIV OF MANCHESTER