Computer case

Abstract

The invention relates to a computer case which comprises a rack for fixing a circuit board module and further comprises a deformation bag abutting against a circuit board, a shaping unit for shaping the abutting deformation bag and a water cooling unit communicating with the deformation bag, and the deformation bag, the shaping unit and the water cooling unit are all connected to the rack. The deformation bag comprises an attaching soft layer attached to one side of the circuit board, a sealing layer connected to the side, away from the circuit board, of the attaching soft layer, and a connecting assembly connecting the sealing layer and the attaching soft layer. The water cooling unit communicates with the watertight inner cavity. The computer case has the effects of increasing the contact area with the circuit board and improving the water-cooling efficiency.

Description

technical field [0001] The present application relates to the field of computer components, in particular to a computer case. Background technique [0002] At present, the computer case is a part of computer accessories, and its main function is to place and fix each computer accessory, and play a role of support and protection. [0003] Among computer accessories, the circuit board connecting key accessories such as CPU, graphics card, and memory stick is the most important. The processing speed of the CPU is directly related to the performance of the computer, and the graphics card is directly related to the quality of the displayed graphics. With the development of the times, the core frequency of the chip is getting higher and higher, and the processing speed is getting faster and faster, but any chip has a certain power loss when it is working, and most of the power loss is converted into heat energy. The higher the core frequency of the chip, The more heat energy, if ...

AI Technical Summary

Problems solved by technology

With the development of the times, the core frequency of the chip is getting higher and higher, and the processing speed is getting faster and faster, but any chip has a certain power loss when it is working, and most of the power loss is converted into heat energy. The higher the core frequency of the chip, The more heat energy, if no heat dissipation measures are taken, the temperature of the die can reach or exceed the allowable junction temperature, and the chip will be damaged

[0004] In the related art, the chassis has two cooling methods, liquid cooling and air cooling, but the heat dissipation performance of air cooling is poor; when using water cooling for cooling, the water flow is limited by the water flow pipes, and it is difficult to fully contact the central processing unit, so it cannot be fully cooled. To play the role of water cooling, there are certain deficiencies

Images