Cavity cover, semiconductor etching device and temperature control method thereof
An etching device and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, discharge tubes, electrical components, etc., can solve problems such as poor temperature stability, achieve the effects of improving stability, realizing accurate control, and improving product yield
Pending Publication Date: 2021-02-23
CHANGXIN MEMORY TECH INC
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Problems solved by technology
[0006] The invention provides a chamber cover, a semiconductor etching device and a temperature control method thereof, which are used to solve the problem of poor temperature stability in the etching chamber in the prior art when performing etching, so as to improve the etching quality of the wafer and increase the Product yield
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[0041] The specific implementations of the chamber cover, semiconductor etching device and temperature control method thereof provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0042] In the dry etching process, the temperature in the reaction chamber is regulated through the temperature control plate in the chamber cover, and the temperature control plate itself relies on the heating plate and the cooling plate to regulate the temperature, that is, through both the heating plate and the cooling plate To maintain the stability of the temperature of the temperature control plate, and then ensure the stability of the temperature in the reaction chamber.
[0043] However, in the current semiconductor etching device, since the coolant passing through the cooling plate usually comes directly from the cooler, if the flow rate of the coolant is kept constant during the entire etching process, it will easily lead to overhe...
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The invention relates to the technical field of semiconductor manufacturing, in particular to a cavity cover, a semiconductor etching device and a temperature control method thereof. The cavity coveris used for sealing a reaction cavity and comprises a temperature control board internally provided with a temperature sensor used for measuring the temperature of the temperature control board, an input pipeline connected with the temperature control board, communicated in the temperature control board and used for transmitting a heat exchange medium so as to exchange heat with the temperature control board, and a medium controller connected with the input pipeline and used for adjusting the state of the heat exchange medium conveyed in the input pipeline based on the temperature of the temperature control plate. The phenomenon that the temperature difference between the temperature control plate and the reaction chamber is too large is avoided, the wafer etching quality is improved, andthe product yield is increased.
Description
technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a chamber cover, a semiconductor etching device and a temperature control method for the semiconductor etching device. Background technique [0002] Currently, the semiconductor integrated circuit (IC) industry has experienced exponential growth. Technological advances in IC materials and design have produced generations of ICs, where each generation has smaller and more complex circuits than the previous generation. In the course of IC evolution, functional density (ie, the number of interconnected devices per chip area) has generally increased and geometry size (ie, the smallest component that can be produced using a fabrication process) has continued to decrease. In addition to IC components getting smaller and more complex, the wafers on which the ICs are fabricated are getting bigger and bigger, which places higher demands on the quality of the wafers. ...
Claims
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Login to View More IPC IPC(8): H01J37/16H01J37/30H01J37/305H01L21/67
CPCH01J37/16H01J37/3002H01J37/3056H01L21/67248
Inventor 不公告发明人
Owner CHANGXIN MEMORY TECH INC