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Support for heat-sensitive porous plate base paper and heat-sensitive porous plate base paper

A support, stencil technology, applied in paper/cardboard layered products, printing plates, chemical instruments and methods, etc., can solve the problems of easy perforation, poor adhesion between TPH and film, difficult to perforate, etc.

Active Publication Date: 2021-02-26
RISO KAGAKU CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Thermal head (TPH) is usually used for plate making of stencil base paper. If there are irregularities on the surface of stencil base paper, the adhesion between TPH and film will deteriorate during plate making, and parts that are easy to perforate and parts that are difficult to perforate will occur.
Therefore, sometimes it is impossible to perforate like the original, and a good printed image cannot be obtained using this stencil base paper

Method used

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  • Support for heat-sensitive porous plate base paper and heat-sensitive porous plate base paper
  • Support for heat-sensitive porous plate base paper and heat-sensitive porous plate base paper

Examples

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Embodiment

[0085] Hereinafter, although this invention is demonstrated in detail based on an Example and a comparative example, this invention is not limited only to these Examples. "%" means "mass%" unless otherwise stated. The compounding quantity of each component in a table|surface is also shown by "mass %".

[0086]

[0087] Table 1 shows the raw material of the support body (support body) for heat-sensitive stencil base papers of Examples 1-5 and Comparative Examples 1-2, and the characteristic value of each support body. Each support body contained the raw material (hemp pulp, polyester fiber, and polyacrylonitrile fiber) in the ratio shown in Table 1.

[0088] Regarding each support body, using the raw materials in the ratio shown in Table 1, papermaking was carried out using a cylinder paper machine so as to achieve a specific basis weight, tensile elongation at break, and tensile strength ratio, and a dip coater was used to at 1.3g / m 2 The coating amount (solid content) of...

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Abstract

The present invention is a support for a heat-sensitive porous plate base paper and the heat-sensitive porous plate base paper, the support for the heat-sensitive porous plate base paper comprising ahemp pulp and a synthetic fiber, and the ratio of the tensile elongation at break specified in JAPAN TAPPI No.71 in the lateral direction to the tensile elongation at break specified in JAPAN TAPPI No.71 in the longitudinal direction being 1.0-1.4.

Description

technical field [0001] An embodiment of the present invention relates to a support for a heat-sensitive stencil base paper and a heat-sensitive stencil base paper. Background technique [0002] A heat-sensitive stencil base paper (hereinafter sometimes referred to as "stencil base paper") generally includes a porous support and a thermoplastic resin film laminated on the porous support. [0003] Thermal head (TPH) is usually used for plate making of stencil base paper. If there are irregularities on the surface of stencil base paper, the adhesion between TPH and film will deteriorate during plate making, and parts that are easy to perforate and parts that are difficult to perforate will occur. . Therefore, it may not be perforated like a manuscript, and a good printed image cannot be obtained using this stencil base paper. [0004] Patent Document 1 discloses a base paper for heat-sensitive stencil printing whose tensile strength and elongation properties are set to specif...

Claims

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Application Information

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IPC IPC(8): B41N1/24B32B5/02B32B27/10B32B27/12B32B29/00
CPCB41N1/24B32B5/02B32B5/022B32B5/028B32B27/10B32B27/12B32B29/002
Inventor 荒井正胜松浦宏和山本光保
Owner RISO KAGAKU CORP