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Preparation method of double-sided metasurface structure

A metasurface and double-sided technology, which is applied in the field of preparation of double-sided metasurface structures, can solve problems such as poor alignment accuracy of graphics on both sides, and achieve the effects of easy operation, simple measurement and quantification methods, and high precision

Pending Publication Date: 2021-02-26
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a method for preparing a double-sided metasurface structure, which is used to solve the problems caused by the process line width and material constraints in the preparation of the double-sided metasurface structure in the prior art. Limitations such as opacity lead to problems such as poor alignment accuracy of the two-sided graphics of the formed double-sided metasurface structure

Method used

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  • Preparation method of double-sided metasurface structure
  • Preparation method of double-sided metasurface structure
  • Preparation method of double-sided metasurface structure

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Embodiment 1

[0063] This embodiment provides a method for preparing a double-sided metasurface structure, the preparation method comprising:

[0064] Such as Figure 4 to Figure 6 As shown, step S1 is first performed to provide a first photoresist plate and a second photoresist plate, and the first photoresist plate has a first mark 10 (such as Figure 4 shown), the second photoresist has a second mark 20 (such as Figure 5 shown), the first mark 10 and the second mark 20 are in a mirror image relationship, and the first mark 10 and the second mark 20 have the functions of positive and negative alignment, positive and negative offset error measurement and the next Process step alignment function.

[0065] It should be noted here that the first marker 10 and the second marker 20 may also have other functions than the above-mentioned functions, which are specifically set according to actual needs.

[0066] The first mark 10 and the second mark 20 can be set to mark multiple functions, or ...

Embodiment 2

[0081] This embodiment provides a method for preparing a double-sided metasurface structure. The preparation method is basically the same as that of Embodiment 1, except that the first mark 10 on the first photoresist plate provided in step S1 and the mark 10 on the second photoresist board are provided in step S1. The second mark 20 also has a metasurface structure alignment measurement reference function; after obtaining the second substrate sample, the alignment offset of the double-sided metasurface structure can be obtained according to the mark of the metasurface structure alignment measurement reference function Error, specifically: according to the metasurface structure alignment measurement reference function of the first mark 10 and the second mark 20, measure and calculate the difference between the metasurface structure pattern on each side and the metasurface structure alignment measurement reference function The relative position offset between the marks, and then...

Embodiment 3

[0086] Such as Figure 12 As shown, this embodiment provides a method for preparing a double-sided metasurface structure, which is basically the same as that of Embodiment 1, except that in step S4, the graphic layout of the double-sided metasurface structure provided by this embodiment is in the The same vacant position of the double-sided metasurface structure graphic layout mirror image is also provided with a metasurface structure alignment measurement reference mark; after obtaining the second substrate sample, it can be directly measured according to the mirrored metasurface structure alignment measurement reference mark Alignment offset error of double-sided metasurface structures.

[0087] As an example, the design of the metasurface structure alignment measurement reference function markers 14, 24 is very flexible, and its shape can adopt the existing cross mark type, comb tooth mark type, overlay mark type or ring mark type single-marker type, or a composite marker ...

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Abstract

The invention provides a preparation method of a double-sided metasurface structure. The method comprises the following steps: providing a first photoetching plate and a second photoetching plate which are marked in a mirror image relationship, and the marks have the functions of forward and reverse alignment, forward and reverse offset error measurement and next process step alignment; providinga substrate, and respectively transferring the patterns marked in the mirror image relationship to two sides of the substrate to obtain a first substrate sample; screening out a first substrate sampleof which the offset error is within a required range to obtain a qualified first substrate sample; putting the qualified first substrate sample into photoetching equipment used in the next step, identifying a mark with a next process step alignment function on the qualified first substrate sample, respectively transferring the double-sided metasurface structure pattern layout to the front side and the back side of the qualified first substrate sample, and obtaining a second substrate sample and etching to obtain the double-sided metasurface structure. By adopting the method, the double-sidedmetasurface structure with high-precision alignment can be successfully manufactured, so that the performance of the double-sided metasurface structure is improved.

Description

technical field [0001] The invention relates to the field of micro-nano optics and optical imaging, in particular to a method for preparing a double-sided metasurface structure, so as to realize high-precision alignment of the double-sided metasurface structure. Background technique [0002] In recent years, micro-nanostructured metasurfaces have become a new method to control light by forming subwavelength structures on a plane. With special electromagnetic properties and excellent interface manipulation capabilities, this subwavelength structure design can locally change the amplitude, polarization, and phase of incident light, and is small in size and light in weight, enabling compact optical structures, so it has attracted much attention. [0003] The following uses an application in metasurfaces, metasurface lens, as an example to illustrate the prior art and its existing problems. Such as figure 1 and figure 2 As shown, a schematic diagram of a single-sided metasur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00G03F9/00
CPCB81C1/00603B81C1/00373B81C1/00523G03F9/7088
Inventor 李伟王磊周易甘峰源杨雪雷
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI