Air cooling and water cooling combined cooling equipment for electronic circuit board production

A technology for electronic circuit boards and cooling equipment, applied in the direction of secondary processing of printed circuits, etc., can solve problems such as affecting production efficiency and production process, slow cooling speed, etc., and achieve the effect of improving production quality, improving cooling efficiency, and avoiding pollution.

Inactive Publication Date: 2021-02-26
于海庆
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] After the electroplating of the electronic circuit board is completed, the electronic circuit board needs to be cooled. Most of the usual cooling methods adopt the principle of parti

Method used

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  • Air cooling and water cooling combined cooling equipment for electronic circuit board production
  • Air cooling and water cooling combined cooling equipment for electronic circuit board production
  • Air cooling and water cooling combined cooling equipment for electronic circuit board production

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] see Figure 1~4 , in an embodiment of the present invention, a cooling device for electronic circuit board production combining air cooling and water cooling, comprising a base plate 2, a support frame 1 is fixedly connected to the lower surface of the base plate 2, and a cooling box 7 is fixedly connected to the upper surface of the base plate 2 , the cooling box 7 is fixedly connected with a plurality of supporting plates 27 arranged in parallel, the ...

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Abstract

The invention discloses air cooling and water cooling combined cooling equipment for electronic circuit board production, which relates to the technical field of electronic circuit board production equipment. The air cooling and water cooling combined cooling equipment comprises a bottom plate, a supporting frame is fixedly connected to the lower surface of the bottom plate, a cooling box is fixedly connected to the upper surface of the bottom plate, and a plurality of supporting plates arranged in parallel are fixedly connected into the cooling box. When the equipment is used, the water pumppumps cold water into the heat exchange sleeve through the water pumping pipe and the water conveying pipe, the interior of the cooling box is cooled in a water-cooling heat exchange mode, the draughtfan pumps outside air into the cooling box through the air suction pipe, the first air conveying pipe and the second air conveying pipes, and the air is exhausted through the fourth air conveying pipes. The cooling box is cooled in an air cooling mode, so that the electronic circuit board in the cooling box can be cooled in a mode of combining air cooling and water cooling in the cooling process,the cooling efficiency is improved, and the production process is accelerated.

Description

technical field [0001] The invention relates to the technical field of electronic circuit board production equipment, in particular to a cooling equipment for electronic circuit board production combining air cooling and water cooling. Background technique [0002] Electronic circuit board is the provider of electrical connection of electronic components. Its development has a history of more than 100 years. Its design is mainly layout design. The main advantage of using circuit board is to greatly reduce wiring and assembly errors and improve With the automation level and production labor rate, electronic circuit boards have developed from single-layer boards to double-sided boards, multi-layer boards and flexible boards, and are constantly developing in the direction of high precision, high density and high reliability. Continuous reduction in size, cost reduction, and performance improvement enable printed circuit boards to maintain strong vitality in the development of f...

Claims

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Application Information

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IPC IPC(8): H05K3/22
CPCH05K3/22
Inventor 于海庆
Owner 于海庆
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