Semiconductor equipment and lower electrode thereof

Abstract

The invention discloses semiconductor equipment and a lower electrode thereof. The lower electrode comprises a base, an insulating part, at least three pressure detection supporting parts, a bearing piece and a focusing ring borne on the bearing piece, wherein the insulating part is fixed on the base, and the insulating part has at least three mounting through holes; the at least three pressure detection supporting parts are installed in the at least three installation through holes in a one-to-one correspondence mode, the at least three pressure detection supporting parts are all supported bythe base, and the surfaces of the at least three pressure detection supporting parts are all higher than the surface of the insulating part; and each pressure detection supporting part is in contactwith the bearing part and is used for supporting the bearing part and the focusing ring and detecting the pressure of the bearing part and the focusing ring. According to the semiconductor equipment and the lower electrode thereof, the problem that the yield of the wafer is reduced due to the fact that whether the focusing ring needs to be replaced or not cannot be accurately known at present, andconsequently the focusing ring which has a large adverse effect on the uniformity of the wafer is still used can be solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a semiconductor device and its lower electrode. Background technique [0002] Etching machine is an important equipment in the process of semiconductor processing. In the process of etching a wafer, there is usually a focus ring outside the wafer. During the process of etching the wafer, plasma will enter the gap between the focus ring and the wafer. As a result, both the outer edge of the wafer and the inner edge of the focus ring will be etched. In the initial stage of the use of the focus ring, since the focus ring is not etched or etched to a lesser extent, the etching rate of the outer edge of the wafer is basically the same as the etching rate of the wafer surface, which can ensure that the wafer has a high Uniformity. [0003] However, with the increase of the use time of the focus ring, more and more parts are etched away inside the focus ring, resultin...

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Problems solved by technology

[0004] The invention discloses a semiconductor device and its lower electrode to solve the problem that it is currently impossible to accurately know whether the focus ring should be replaced, resulting in the still use of the focus ring that has had a relatively large adverse effect on the uniformity of the wafer, thereby reducing the cost of the wafer. The problem of yield rate

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