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Package and method of forming same

A technology for packaging and connecting devices, applied in the field of packaging and its formation, can solve problems such as high cost and complex packaging process, and achieve the effect of reducing complexity, manufacturing cost, and cost

Active Publication Date: 2021-03-02
SHANGHAI YIBU SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The packaging process of traditional stacking technology is more complicated and the cost is higher

Method used

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  • Package and method of forming same
  • Package and method of forming same
  • Package and method of forming same

Examples

Experimental program
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Embodiment Construction

[0034] The following disclosure provides many different embodiments or examples for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to limit the invention. For example, in the following description, forming a first component on or on a second component may include an embodiment in which the first component and the second component are formed in direct contact, and may also include an embodiment in which an additional component may be formed between the first component and the second component. components so that the first component and the second component may not be in direct contact with each other. In addition, the present invention may repeat reference numerals and / or characters in various embodiments. This repetition is for the sake of simplicity and clarity and does not in itself indicate a relationship betwe...

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PUM

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Abstract

The present invention provides a method of forming a package, the method comprising the steps of: placing a plurality of first chip layers over a carrier, each first chip layer comprising a pluralityof first chips facing downward from a front side and a plurality of chip couplers between the plurality of first chips; placing and assembling a second chip layer on the plurality of first chip layers, wherein the second chip layer comprises a plurality of second chips with downward front surfaces; carrying out molding processing on the plurality of first chip layers and the second chip layer above the carrier; removing the carrier to form a package main body, and adding a redistribution layer and bumps below the package main body; and segmenting the package body to form a plurality of the packages.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a package and a forming method thereof. Background technique [0002] At present, more and more functions are required for semiconductor integrated circuits, and the required calculation speed is getting faster and faster. Under this situation, the industry has begun to increase investment in the research and development of chip stacking technology to explore more efficient solution. However, conventional wafer-level packaging (WLP) technology cannot achieve chip stacking. In the traditional chip stacking technology, stacking is mostly completed in the final assembly, and it is necessary to use through silicon vias (TSV, Through Silicon Via), glass substrate through holes (TGV, Through Glass Via), plastic layer through holes ( TMV, Through MoldVia) or wire bonding (Wire-bond) and other technologies to realize the vertical connection between stacked chips. The packaging ...

Claims

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Application Information

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IPC IPC(8): H01L21/98H01L21/60H01L23/488H01L25/18H01L23/31
CPCH01L23/3128H01L24/02H01L24/13H01L24/11H01L25/18H01L25/50H01L2224/13008H01L2224/111H01L2224/02333H01L2224/02381H01L25/0652H01L25/0657H01L2225/06513H01L2225/06524H01L2225/06541
Inventor 李维平
Owner SHANGHAI YIBU SEMICON CO LTD