Full-automatic labeling device for wafer packaging box

Abstract

The invention discloses a full-automatic labeling device for a wafer packaging box. The automatic labeling device comprises an overall rack, a feeding platform, a rotary lifting transversely-moving conveying belt, a top clamping device, an ID label marking and stripping device, a warning label stripping device, an ID label pasting device, a warning label pasting device and a shooting device. The feeding platform and the rotary lifting transversely-moving conveying belt are both fixed to the overall rack, the feeding platform is arranged at the inlet end of the rotary lifting transversely-moving conveying belt, and the top clamping device is fixed above the feeding platform and the rotary lifting transversely-moving conveying belt. The ID label marking and stripping device, the warning label stripping device, the warning label pasting device and the ID label pasting device are mounted at the position, on the same side of the rotary lifting transversely-moving conveying belt, of the overall rack. The device can automatically complete labeling work of the wafer packaging box, the automation degree is high, the manpower consumption is reduced, and the labeling efficiency is high.

Description

technical field [0001] The invention relates to the field of labeling of wafer packaging boxes, and more specifically, relates to a fully automatic labeling device for wafer packaging boxes. Background technique [0002] Wafer refers to a silicon chip made of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. A wafer is a carrier used in the production of integrated circuits. A wafer in the general sense basically refers to It is a single crystal silicon wafer. The single crystal silicon wafer is refined from ordinary silicon sand. After being dissolved, purified, and distilled, it supports a single crystal silicon rod. After the single crystal silicon rod is polished and sliced, it becomes a wafer. With the continuous development of integrated circuit manufacturing technology, the feature size of the chip is getting smaller and smaller, the number of interconnection layers is increasing, and the diameter of the wafer is also incr...

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to solve the problem that the existing automatic labeling machine cannot meet the various requirements for labeling wafer packaging boxes, and proposes a fully au

Images