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Computer intelligent thermal management system and thermal management method

An intelligent thermal management and computer technology, applied in computing, electrical digital data processing, digital processing power distribution, etc., can solve the problems of low service life of the thermal management system, waste of cooling resources, difficult maintenance, etc., to avoid waste of cooling resources , prolong service life, reduce maintenance difficulty and cost

Pending Publication Date: 2021-03-12
XIAN AVIATION COMPUTING TECH RES INST OF AVIATION IND CORP OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] To sum up, the current computer thermal management system using liquid cooling technology has a large waste of cooling resources, and the thermal management system has a low service life and is difficult to maintain

Method used

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  • Computer intelligent thermal management system and thermal management method
  • Computer intelligent thermal management system and thermal management method
  • Computer intelligent thermal management system and thermal management method

Examples

Experimental program
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Effect test

Embodiment Construction

[0036] The computer system of the present invention includes an electronic module (1), a chassis (2), a fluid pipeline (3), a radiator (4), a fan (5), a pump (6), a liquid storage device (7), a control module ( 8) etc. The electronic module contains electronic components (11) inside and heat dissipation fins (12) outside, and the temperature of the electronic components is measured by a temperature sensor on the components and then output to the control module. There are ventilation holes (21) on the upper and lower side walls of the casing, and passages (22) for fluid flow are arranged in the casing. The fluid lines contain coolant for heat dissipation. There are radiator passages (41) and fins (42) for fluid flow in the radiator, gaps for air flow are arranged between the fins, flow channels in the radiator, fluid pipelines, flow channels in the cabinet, storage The liquid device and the pump form a fluid circulation channel, and there is cooling liquid in the channel. Bo...

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Abstract

The invention provides a computer intelligent thermal management system and a thermal management method, the computer intelligent thermal management system comprises an electronic module (1), a case (2), a fluid pipeline (3), a radiator (4), a fan (5), a pump (6), a liquid storage device (7) and a control module (8); the case (2) is a box structure, the side wall of the case (2) is provided with vent holes (21), a channel (22) for fluid to flow is formed in the side wall of the case, and cooling liquid used for heat dissipation is arranged in the channel (22); a plurality of electronic modules(1) are arranged in the case (2), a plurality of electronic elements (11) are arranged in the electronic modules (1), radiating fins (12) are arranged outside the electronic modules (1), temperaturesensors are arranged on the electronic elements (11), and the temperature sensors are connected with the control module (8); the radiator (4) is provided with radiator channels (41) and fins (42), wherein fluid can flow through the radiator channels (41) and the fins (42).

Description

technical field [0001] This application relates to heat dissipation technology for electronic equipment, in particular to a computer intelligent thermal management system and thermal management method Background technique [0002] Thanks to the rapid development of microelectronics technology, the performance of integrated circuits has been continuously improved, and electronic equipment represented by computers is developing in the direction of miniaturization, integration, and high density, which makes the heat flux of electronic chips higher and higher. However, the failure rate of electronic devices is closely related to temperature, and an increase in temperature will lead to a decrease in chip reliability. Therefore, thermal management technology for the purpose of controlling chip temperature has attracted more and more attention. Traditional electronic equipment thermal management technologies include natural heat dissipation, air cooling, liquid cooling technology, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20G06F1/3206G06F1/3287G06F11/30
CPCG06F1/183G06F1/20G06F1/3206G06F1/3287G06F11/3058G06F2200/201
Inventor 周尧
Owner XIAN AVIATION COMPUTING TECH RES INST OF AVIATION IND CORP OF CHINA
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