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Intelligent power module and packaging method of intelligent power module

A technology of intelligent power modules and sealing layers, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as large tolerances of aluminum substrates, cracks in insulating layers, and increased defective rate of module production, so as to reduce stress and improve finished products Yield rate, the effect of avoiding poor packaging

Pending Publication Date: 2021-03-16
广东汇芯半导体有限公司
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AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved in the present invention is to solve the problem that in the packaging process of the existing IPM module, due to the large tolerance of the aluminum substrate, the insulation layer cracks in the thimble scheme will eventually lead to an increase in the defective rate of the module.

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Embodiment Construction

[0041] It should be noted that, under the condition that there is no conflict in structure or function, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below based on examples.

[0042] The invention provides an intelligent power module. figure 2 A schematic diagram showing the packaging structure of the IPM module according to the embodiment of the present invention. refer to figure 2 , the IPM module 100 includes a substrate 110 , a plurality of electronic components (not shown in the figure), a plurality of pins 120 and a sealing layer 130 .

[0043] The substrate 110 includes a metal heat dissipation layer 111 , an insulating layer 112 , a wiring layer 113 and a green oil layer 114 connected in sequence. The specific structure of the substrate 110 is as image 3 As shown, the lowermost metal heat dissipation layer 111 occupies most of the volume of the subs...

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Abstract

The invention discloses an intelligent power module and a packaging method of the intelligent power module. An eliminating structure is arranged on the part, in a sealing layer, of a pin, a stress eliminating structure generates elastic deformation when stress is applied, the stress of stretching force and extrusion force transmitted to a substrate by the pin can be effectively reduced, therefore,the stress finally transmitted to an insulating layer is greatly reduced, the result of poor packaging caused by cracks generated on the insulating layer is avoided, and the yield of packaged finished products is improved.

Description

technical field [0001] The invention relates to an intelligent power module and a packaging method for the intelligent power module, belonging to the technical field of power semiconductor devices. Background technique [0002] During IPM (Intelligent Power Module, intelligent power module) module packaging, due to the thickness tolerance industry standard of the aluminum substrate +-10%, the large tolerance makes the aluminum substrate and the mold unable to achieve a precise fit, which leads to some occurrences in the IPM module packaging process. In order to solve this problem, an ejector pin is added in the mold cavity, and the ejector pin withstands the aluminum substrate to make it tightly iron on the surface of the cavity, so as to overcome the gap between the aluminum substrate and the cavity caused by the tolerance. This method During the module injection molding packaging process, the external force of the thimble will cause cracks in the insulating layer of the al...

Claims

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Application Information

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IPC IPC(8): H01L23/49H01L23/31H01L23/367H01L23/373H01L21/50H01L21/56
CPCH01L21/50H01L21/565H01L23/3121H01L23/367H01L23/3736H01L23/49
Inventor 杨忠添
Owner 广东汇芯半导体有限公司
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