Intelligent power module and packaging method of intelligent power module
A technology of intelligent power modules and sealing layers, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as large tolerances of aluminum substrates, cracks in insulating layers, and increased defective rate of module production, so as to reduce stress and improve finished products Yield rate, the effect of avoiding poor packaging
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[0041] It should be noted that the features and embodiments in the present invention can be combined with each other in the case where structural or function is not conflict. The present invention will be described in detail below according to an example.
[0042] The present invention proposes an intelligent power module. figure 2 A schematic diagram showing the package structure of the IPM module of the embodiment of the present invention is shown. reference figure 2 The IPM module 100 includes a substrate 110, a plurality of electronic components (not shown), plurality of pins 120, and sealing layer 130.
[0043] The substrate 110 includes a metal heat dissipation layer 111, an insulating layer 112, a wiring layer 113, and a green oil layer 114 that are sequentially connected. The specific structure of the substrate 110 is like image 3 As shown in, the lowermost metal heat dissipation layer 111 occupies most of the volume of the substrate 110, and the thickness is much thick...
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