Synchronous measuring device for deformation field and temperature field in orthogonal cutting process

Abstract

The invention belongs to the related technical field of precision cutting machining measurement, and discloses a synchronous measuring device for a deformation field and a temperature field in an orthogonal cutting process. The synchronous measuring device comprises a combined lens system comprising an objective lens and a beam splitter connected with the objective lens, the objective lens is aligned with an orthogonal cutting area, wherein the beam splitter is used for transmitting infrared light and reflecting visible light. The combined lens system further comprises a first focusing lens, afirst lens, a second focusing lens, a second lens, a relay lens, a medium wave thermal infrared imager, a visible light high-speed camera, a control device and a processor, wherein the first focusinglens and the first lens are arranged on an infrared light path of the beam splitter, the second focusing lens and the second lens are arranged on a visible light path of the beam splitter, the firstfocusing lens and the second focusing lens are arranged in a telescopic sleeve, the relay lens is arranged between the beam splitter and the second focusing lens, and the processor processes and reconstructs infrared images and visible light images to obtain the deformation field and the temperature field in the cutting process. According to the synchronous measuring device, imaging acquisition ofthe temperature field and the deformation field on a micro-scale can be realized, and the efficiency and the precision are high.

Description

technical field [0001] The invention belongs to the related technical field of precision cutting machining measurement, and more specifically relates to a synchronous measuring device for deformation field and temperature field in orthogonal cutting process. Background technique [0002] In recent years, with the increasing demand for product miniaturization, micro-miniature components have been widely used in aerospace, medical equipment, and optical communications. Among them, precision cutting is one of the important processing techniques for actually producing micro-miniature components . In precision machining, when the machining scale is at the micron level, the thermal-mechanical coupling between the tool and the workpiece will affect the quality and accuracy of the machined surface. In order to further improve the manufacturing process level and improve the machining accuracy, it is necessary to conduct further analysis in combination with the deformation of the wor...

AI Technical Summary

Problems solved by technology

However, these two measurement methods are mostly used for the measurement of the cutting process alone, and the simultaneous change law of the deformation field and the temperature field cannot be obtained.

In addition, the existing devices and methods for synchronous measurement of the deformation field in the temperature field have the following disadvantages: (1) use a color CCD camera to shoot speckle images, and then calculate based on the DIC method or colorimetry method. The accuracy of the calculated temperature field data is not high, it cannot meet the requirements of precision cutting, and it is impossible to directly see the change of the temperature field in the cutting area during the shooting process; When the magnification reaches 20X or more, it is impossible to focus on the micro-sized cutting area at the same time. At this time, the object distance of the camera is less than 50mm, which makes the calibration work before measurement very difficult.

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