Grinding device, grinding machine and grinding method

Abstract

The invention relates to a grinding device, a grinding machine and a grinding method, wherein the grinding device comprises: a workbench; a rotating table arranged on the workbench; at least one vacuum suction cup arranged on the rotating table; a grinding disk located on the vacuum suction cup Above; the first cleaning device is set on the rotary table to clean and cool the grinding area of ​​the contact part between the grinding disc and the vacuum suction cup; the first cleaning and drying device is movably set on the worktable to clean the grinding area after grinding The backside of the silicon wafer is cleaned and dried. The first cleaning device of the grinding device of the present invention is specially designed for cleaning and cooling the grinding area, which enhances the cooling effect while reducing the waste of water resources, and realizes cleaning while the silicon wafer is being ground.

Description

technical field [0001] The invention belongs to the technical field of wafer forming and processing, and particularly relates to a grinding device, a grinding machine and a grinding method. Background technique [0002] The grinding process of silicon wafers is very common in the semiconductor field. There are two main applications. One is to reduce the excess thickness of the backside after the chip is manufactured, and remove the unused part to facilitate the subsequent packaging and testing process; In the circle manufacturing process, in order to improve the surface state of the silicon wafer and increase the flatness, the silicon wafer is polished to facilitate the subsequent polishing process. [0003] The existing silicon wafer grinding parts cannot be cleaned while the silicon wafer is being ground. In addition, during the grinding process, cooling water is sprayed from the edge of the grinding wheel to cool the grinding area and take away the ground powder. The rea...

AI Technical Summary

Problems solved by technology

[0003] The existing silicon wafer grinding parts cannot be cleaned while the silicon wafer is being ground. In addition, during the grinding process, cooling water is sprayed from the edge of the grinding wheel to cool the grinding area and take away the ground powder. The part of the grinding wheel in real contact with the silicon wafer accounts for about a quarter of the grinding wheel, but the cooling water discharge holes are evenly distributed on the circumference of the grinding wheel, which will make the other three quarters of the cooling water discharge less effective. Water is also a waste

Moreover, because a large amount of grinding silicon powder and grinding wheel shedding can be produced in the silicon wafer grinding process, the grinding parts of the existing silicon wafer cannot be cleaned in time to discharge the grinding silicon powder and grinding wheel shedding, which is easy to produce grinding wheel marks on the silicon wafer surface, increasing The damaged layer of the large silicon wafer reduces the grinding quality of the silicon wafer

In addition, the existing grinding device places the ground silicon wafer on the rotating device, and uses the rotating device to rotate at a high speed to clean and dry the silicon wafer. During this process, the silicon wafer rotates at a high speed, and the silicon wafer is prone to cracking.

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