Epoxy resin dispensing device for manufacturing electronic components

Abstract

The invention discloses an epoxy resin dispensing device for manufacturing electronic components, and belongs to the technical field of electronics. The epoxy resin dispensing device comprises a firstbase, and top plates are transversely welded to the tops of a first vertical plate and a second vertical plate. A sliding rod is transversely welded to the upper portion between the first vertical plate and the second vertical plate, a fixing block is welded to the bottom of the sliding block, a servo motor is connected to the upper portion of the side wall of the second vertical plate through screws, and a threaded rod is welded to the output end of the servo motor. A first electric cylinder is fixed to the bottom of the fixing block, and a rubber box is welded to the end of a piston rod ofthe first electric cylinder. Through forward and reverse rotation of the servo motor, the first electric cylinder and the rubber box can be driven to move left and right, so that long-distance dispensing of the rubber box is realized. The first electric cylinder can adjust the height of the rubber box through extension and retraction of a piston rod. Under the heating action of two heating copperpipes, rubber material in the rubber box can be heated and insulated, and the rubber material is prevented from being cooled and solidified. According to the invention, a second electric cylinder canadjust the use height of the equipment.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an epoxy resin dispensing device for manufacturing electronic components. Background technique [0002] Electronic components are basic elements in electronic circuits, usually individually packaged, and have two or more leads or metal contacts. Electronic components must be connected to each other to form an electronic circuit with specific functions, such as amplifiers, radio receivers, oscillators, etc. One of the common ways to connect electronic components is to solder them to a printed circuit board. Electronic components may be individual packages (resistors, capacitors, inductors, transistors, diodes, etc.), or groups of varying complexity, such as integrated circuits (op amps, resistors, logic gates, etc.). In order to maintain the stability of the operation of electronic components, they are usually encapsulated with synthetic resin to improve insulation and protec...

AI Technical Summary

Problems solved by technology

[0003] Existing epoxy resin dispensing equipment can only apply one point at a time during dispensing, and it is difficult to carry out long-distance dispensing. At the same time, because some dispensing equipment is difficult to adjust the height, under some production conditions that need to adjust the height, It often makes the operator uncomfortable to use, and because the epoxy resin glue is easy to solidify after being placed for a long time, it will affect the dispensing and encapsulation

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