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Semiconductor silicon rod grinding device for high-end equipment manufacturing

A semiconductor and equipment technology, applied in the field of semiconductor silicon rod grinding devices for high-end equipment manufacturing, can solve the problems of affecting grinding quality, inconvenient mechanical clamping and feeding, unstable grinding rhythm, etc., to improve efficiency and stability. sexual effect

Pending Publication Date: 2021-03-30
广州方群科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the disadvantages of the inconvenience of mechanical clamping and feeding, and the unstable grinding rhythm affecting the grinding quality, the technical problem of the present invention is to provide a semiconductor silicon rod grinding for high-end equipment manufacturing with high feeding efficiency and stable grinding rhythm. device

Method used

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  • Semiconductor silicon rod grinding device for high-end equipment manufacturing
  • Semiconductor silicon rod grinding device for high-end equipment manufacturing
  • Semiconductor silicon rod grinding device for high-end equipment manufacturing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Such as figure 1 As shown, a semiconductor silicon rod grinding device for high-end equipment manufacturing includes a bottom plate 1, a support frame 2, a grinding mechanism 3, and a locking mechanism 4. A support frame 2 is symmetrically arranged on the top of the bottom plate 1. Between the two support frames 2 A grinding mechanism 3 is arranged between them, and a locking mechanism 4 is arranged on the top of the grinding mechanism 3 .

[0026] A semiconductor silicon rod grinding device for high-end equipment manufacturing, using the rotating operation of the grinding mechanism 3 to keep the abrasive in the drum always on the outer peripheral side of the inner wall of the drum due to centrifugal force, and generate a fluid layer under the relative action of the inner wall of the hexagonal cylinder , in the fluidized layer, the relative movement of the abrasive material and the silicon rod will continuously produce fine grinding on the surface of the silicon rod, so...

Embodiment 2

[0028] Such as figure 2 and image 3 As shown, on the basis of Embodiment 1, the grinding mechanism 3 includes a first rotating shaft 31, a hexagonal roller 32, a top cover 33, a fixed seat 34 and a servo motor 35, and the support frame 2 is provided with a first rotary shaft through a bearing. Rotating shaft 31, the middle part of the first rotating shaft 31 is provided with a hexagonal drum 32, the top of the hexagonal drum 32 is provided with a top cover 33, the front side of the bottom plate 1 is provided with a fixed seat 34, the top of the fixed seat 34 is provided with a servo motor 35, the output of the servo motor 35 The shaft is connected with the first rotating shaft 31 through a coupling.

[0029] The locking mechanism 4 includes a lock block 41, a rotating disk 42, an arc bar 43, a wedge block 44, a guide block 45, a screw rod 46 and a handle 47, and the tops of the left and right sides of the hexagonal drum 32 are provided with lock blocks 41, and the top cover...

Embodiment 3

[0032] Such as Figure 4 and Figure 5 As shown, on the basis of Embodiment 2, it also includes a first fixed frame 5, a blanking box 6, a loading plate 8, a discharging plate 9, a roller assembly 10 and a push handle 11, and the upper part of the support frame 2 is provided with The first fixed frame 5, the top of the first fixed frame 5 is provided with a blanking box 6, the lower part of the left and right sides of the blanking box 6 is provided with a rectangular hole 7, and the sliding type in the rectangular hole 7 is provided with a loading plate 8, and the loading plate 8 A discharge plate 9 is arranged near the right side, a roller assembly 10 is arranged in the middle of the bottom of the loading plate 8 , and a push handle 11 is arranged on the left side of the loading plate 8 .

[0033] On the other hand, the staff can slide the silicon rods on the loading plate 8 in the discharge box 6 to the discharge plate 9 by pushing the push handle 11. Due to the capacity li...

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Abstract

The invention relates to a grinding device, in particular to a semiconductor silicon rod grinding device for high-end equipment manufacturing. The semiconductor silicon rod grinding device for high-end equipment manufacturing is high in feeding efficiency and stable in grinding rhythm. The semiconductor silicon rod grinding device for high-end equipment manufacturing comprises a bottom plate, a grinding mechanism and a locking mechanism, and supporting frames are symmetrically arranged at the top of the bottom plate; the grinding mechanism is arranged between the two supporting frames; and thelocking mechanism is arranged at the top of the grinding mechanism. A hexagonal roller rotates to enable grinding materials in the hexagonal roller to perform centrifugal rolling grinding on a silicon rod in a relative action mode, and the feeding and discharging efficiency is improved in cooperation with the locking mechanism.

Description

technical field [0001] The invention relates to a grinding device, in particular to a semiconductor silicon rod grinding device for high-end equipment manufacturing. Background technique [0002] Since there is a certain deviation in the outer diameter and roundness during the production of silicon rods and the growth of silicon crystals, and the surface of the outer cylinder is also uneven, it is necessary to grind and trim the outer diameter of the silicon rods to make the size and shape errors are less than the allowable deviation. [0003] In today's silicon rod grinding process, centerless grinding machines are used for grinding. Centerless grinders have workpieces that are clamped mechanically and artificially assisted feeding, especially for batch grinding of small diameter silicon rods. Uncontrollable variables cause unstable grinding rhythm and affect grinding quality. Therefore, how to design a semiconductor silicon rod grinding device for high-end equipment manu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B5/35B24B5/18B24B5/22B24B27/00B24B41/00B24B41/06
CPCB24B5/35B24B5/18B24B5/22B24B27/00B24B41/00B24B41/06
Inventor 彭修广
Owner 广州方群科技有限公司
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