New energy automobile integrated circuit chip test system

Abstract

The invention discloses a new energy automobile integrated circuit chip test system, which comprises a test environment parameter regulation and control module, a current detection module, a chip loss analysis module, a chip defect test acquisition module, a test management platform, a vibration detection module, an infrared integrated management memory and a chip test display terminal, the test management platform is used for estimating, analyzing and evaluating the power loss coefficient in each test box environment, and counting the dynamic damage change coefficient of the integrated circuit chip, so as to accurately analyze the influence degree of the temperature and humidity change in the test box on the performance of the integrated circuit chip, analyze the component performance mutation coefficient of each component in the test process, so that the position of the component with performance mutation can be accurately positioned, whether each component is functionally abnormal or not can be accurately obtained, the chip test accuracy is improved, the position of an abnormal component can be accurately obtained, and abnormal components can be replaced or repaired conveniently.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit chip testing, and relates to a new energy vehicle integrated circuit chip testing system. Background technique [0002] An integrated circuit (integrated circuit) is a microelectronic device or component that uses a certain process to interconnect components and wiring such as transistors, resistors, capacitors, and inductors required in a circuit, and install them on a silicon substrate. To form an integrated integrated circuit chip. [0003] After the integrated circuit chip is manufactured, it is necessary to test the integrated circuit chip. The integrated circuit chip test process is to place the packaged chip in various environments for electrical characteristic testing to determine whether the packaged chip meets the requirements. The existing test Rough electrical characteristic testing methods are often used in technology, that is, only to analyze whether the parameters of the...

AI Technical Summary

Problems solved by technology

[0003] After the integrated circuit chip is manufactured, it is necessary to test the integrated circuit chip. The integrated circuit chip test process is to place the packaged chip in various environments for electrical characteristic testing to determine whether the packaged chip meets the requirements. The existing test Rough electrical characteristic testing methods are often used in technology, that is, only to analyze whether the parameters of the integrated circuit chip are normal after power-on, but cannot accurately analyze whether the components are operating normally under the change of environmental parameters, resulting in poor test accuracy, and then the integration after the test is completed The life of the circuit chip is short in the process of actual use, and during the vibration test of the integrated circuit chip, due to the collision between the test equipment and the integrated circuit chip, the integrated circuit chip partially fails, which affects the result of the vibration test and increases the impact on the integrated circuit chip. The damage degree of the circuit chip. In addition, the existing technology cannot accurately analyze the power loss degree of the integrated circuit chip in different test environments, and the impact of changes in environmental parameters cannot analyze the various components on the integrated circuit chip. Whether the performance of the components is abnormal, resulting in the performance failure of the components that make up the integrated circuit chip due to changes in environmental parameters, and cannot adapt to the changing environmental parameters

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