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Heat dissipation module spraying redundant part removal method and treatment device

A technology of heat dissipation module and processing equipment, applied in welding equipment, laser welding equipment, metal processing equipment and other directions, can solve the problems of inconvenient spraying, unfavorable shielding device, complex structure, etc., and achieve the effect of improving spraying accuracy and optimizing spraying process.

Pending Publication Date: 2021-04-13
昆山宏宏泰电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat dissipation mold is small in size and complex in structure, which is not conducive to setting up a shielding device, which brings inconvenience to spraying

Method used

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  • Heat dissipation module spraying redundant part removal method and treatment device
  • Heat dissipation module spraying redundant part removal method and treatment device

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Experimental program
Comparison scheme
Effect test

Embodiment

[0020] A heat dissipation module spraying excess part processing equipment includes a four-station turntable 10, and a loading manipulator, a laser device, a wiping device and a material-discharging manipulator arranged beside the four-station turntable. A jig 20 is installed on each station plate of the four-station turntable, and the jig includes a jig plate and a pneumatic side pushing block 21. A positioning profiling cavity is arranged in the jig plate, and the pneumatic side pushing block is installed on the positioning imitation block. inside the cavity. The wiping device comprises an alcohol tube and a wiping cotton, and the alcohol tube and the wiping cotton are connected by a pipeline. The laser device includes a laser head 30 and a three-axis displacement mechanism 40, and the laser head is arranged on the Z axis of the three-axis displacement mechanism. Both the feeding manipulator and the unloading manipulator use suction cups as the grabbing tooling for grabbing...

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PUM

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Abstract

The invention provides a heat dissipation module spraying redundant part removal method and treatment device. The removal method comprises the following steps that firstly, a heat dissipation module is placed below a laser head, and redundant parts are removed through a laser process; and secondly, a wiping device wipes a laser area back and forth twice. The treatment device comprises a four-station rotary disc, and a feeding mechanical hand, a laser device, the wiping device and a discharging mechanical hand which are arranged beside the four-station rotary disc. A jig is installed on each station plate of the four-station rotary disc. A dust suction pipe is arranged beside the laser device. The redundant spraying parts on a scattering module are removed through the laser method, and in this way, the heat dissipation module does not need to be shielded in the spraying stage, the spraying process of the heat dissipation module is optimized, and the spraying precision is improved.

Description

technical field [0001] The invention relates to the technical field of spraying, in particular to a method and processing equipment for removing excess spraying parts of a heat dissipation module. Background technique [0002] The welding points of the heat dissipation module do not need to be sprayed, and need to be masked before spraying. However, the heat dissipation mold is small in size and complex in structure, which is not conducive to installing a shielding device and brings inconvenience to spraying. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a method and processing equipment for removing excess spraying parts of a heat dissipation module, so as to achieve the purpose of accurately removing the excess spraying parts after spraying. [0004] In order to solve the problems of the technologies described above, the technical scheme adopted in the present invention is as follows: [0005] A method for ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/36B23K26/70
CPCB23K26/36B23K26/702
Inventor 姜国方陈满绪高玉达何君坪陈家刚
Owner 昆山宏宏泰电子科技有限公司
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