Method for monitoring wafer in semiconductor manufacturing, and mask

Abstract

The invention provides a method for monitoring a wafer in semiconductor manufacturing, and a mask. The method comprises the following steps: acquiring a to-be-monitored semiconductor process and a design rule thereof; designing a monitoring graph according to the design rule, wherein the monitoring graph comprises a key graph corresponding to the semiconductor process on a product wafer; manufacturing a mask plate of the product wafer, wherein the monitoring graph is guided into a cutting channel area of the mask plate of the product wafer in the manufacturing process of the mask plate; and manufacturing the product wafer, and carrying out failure analysis on the product wafer in the process of manufacturing the product wafer. According to the invention, monitoring graphic structures of various different monitoring processes can be simultaneously obtained in a subsequently manufactured product wafer, the workload is low, and the analysis efficiency is high; and for the same process, the monitoring of the overall morphology of the monitoring graph is realized on different products, the influence caused by the change of the monitoring product is avoided, the data is standard and unified, and the long-term monitoring of the process can be realized.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for monitoring wafers in semiconductor manufacturing and a mask. Background technique [0002] In the manufacturing process of semiconductor devices, in order to understand the status of the production line in a timely, accurate and comprehensive manner, large-volume or important process products are usually selected for regular overall shape monitoring. The overall shape monitoring usually selects the die analysis on the wafer or selects the conventional test pattern in the dicing line (also known as the scribe line) and the test pattern of the WAT (Wafer Acceptance Test) for analysis. [0003] When selecting the die on the wafer for analysis, it is often used to regularly select the product wafer of the target process, directly analyze the die designed by the customer, and find a suitable structural pattern in the die, and try to find the same structure every...

AI Technical Summary

Problems solved by technology

Some of the graphics can meet the requirements of overall shape monitoring, but the graphics structure is not comprehensive, and some required structures will be etched away in the subsequent process, resulting in missing graphics

The graphics in the cutting line are scattered in different cutting line areas, and the sectioning position and sectioning direction are different. Analytical technicians need to spend a lot of time on sample preparation when they are working, resulting in heavy workload and low efficiency.

[0005] Therefore, in the actual analysis, there are problems such as difficulty in finding the graphic structure, heavy workload, low work efficiency, incomplete test graphics, inconsistent data specifications, and poor stability and continuity of long-term monitoring data.

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