Punching mechanism of 5G base station high-frequency high-speed PCB and punching method thereof
A PCB board and punching technology, which is applied in the field of punching mechanism of 5G base station high-frequency and high-speed PCB board, can solve the problems of cumbersome operation, different substrate sizes, complex structure, etc., and achieve convenient operation, simple structure, and low manufacturing cost Effect
Active Publication Date: 2021-04-16
赣州新联兴科技有限公司
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Problems solved by technology
[0003] 1. The substrates used to manufacture PCBs are of different sizes and shapes. The positioning mechanism of the traditional punching mechanism cannot automatically adapt to substrates of different sizes and shapes;
[0004] 2. The fastening mechanism of the traditional punching mechanism to the substrate is often complex in structure and cumbersome in operation;
[0005] 3. The waste produced by the traditional punching mechanism is easy to scatter around, and it is not easy to collect and process in a centralized manner.
Method used
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[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0037] see Figure 1-4 ,in figure 1 It is an overall structural diagram of an embodiment of the punching mechanism of the 5G base station high-frequency and high-speed PCB board of the present invention, figure 2 is the overall structure diagram of the positioning mechanism embodiment of the present invention, image 3 for figure 2 A magnified view of A, Figure 4 for figure 2 The enlarged view at B, a punching mechanism for high-frequency and high-spe...
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The invention discloses a punching mechanism of a 5G base station high-frequency high-speed PCB and a punching method thereof, and belongs to the technical field of 5G base station high-frequency high-speed PCBs. According to the technical scheme, the punching mechanism is characterized by comprising a punching part and a discharging part, wherein the punching part is used for executing punching operation, and the discharging part is used for placing a substrate; the punching part comprises a punching power mechanism and a punching head mounted on the punching power mechanism, wherein the punching power mechanism can control the punching head to move in any direction and punch downwards, and the discharging part comprises: a workbench which is a main body of the whole discharging part; a positioning mechanism which is used for positioning the substrate and is arranged on the workbench; and an automatic control mechanism which is used for automatically adjusting the positioning mechanism. According to the punching mechanism of the 5G base station high-frequency high-speed PCB and the punching method thereof disclosed by the invention, substrates of different sizes and shapes can be automatically adapted, the fastening mechanism acting on the substrates is simple in structure and convenient to operate, and waste generated by punching can be effectively and conveniently collected.
Description
technical field [0001] The invention relates to the technical field of high-frequency and high-speed PCBs for 5G base stations, in particular to a punching mechanism and a punching method for high-frequency and high-speed PCBs of 5G base stations. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is a printed circuit board, also known as a printed circuit board, is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components, because it uses electronic printing It is made by PCB technology, so it is called "printed" circuit board. Punching is an indispensable step in the PCB manufacturing process. Today's PCB punching technology is very mature, but there are still many shortcomings as follows: [0003] 1. The substrates used to manufacture PCBs are of different sizes and shapes. The positioning mechanism of the traditional punching mechanism cannot automatically adapt to...
Claims
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IPC IPC(8): B26F1/02B26F1/14B26D7/18B26D7/20B26D7/02
Inventor 杨兴德
Owner 赣州新联兴科技有限公司