Atomic layer deposition equipment and processing method capable of reducing precursor deposition

Abstract

The invention relates to atomic layer deposition equipment capable of reducing precursor deposition. The atomic layer deposition equipment comprises a cavity, a bearing device, a shielding piece, at least one air inlet and at least one extraction opening, and is characterized in that the bearing device and the shielding piece are positioned in a containing space of the cavity; and the shielding piece is used for shielding part of the inner surface of the cavity, and the air inlet is in fluid connection with the containing space of the cavity. In the atomic layer deposition process, gas can be introduced between the inner surface of the cavity and the shielding piece through the air inlet so as to prevent a precursor from entering the space between the cavity and the shielding piece; the extraction opening can extract the precursor which does not react with the base material, so that the residual precursor on the inner surface of the cavity can be reduced, the cleaning period of the cavity is shortened, and the product yield is improved.

Description

technical field [0001] The present invention relates to an atomic layer deposition equipment and process method that can reduce the deposition of precursors. An air wall can be formed between the shielding member and the inner wall to prevent unreacted precursors from remaining on the inner surface of the chamber during the atomic layer deposition process. Atomic layer deposition equipment and process method. Background technique [0002] The development of integrated circuit technology has matured, and the current electronic products are developing towards the trend of light, thin and small, high performance, high reliability and intelligence. The miniaturization technology of transistors in electronic products is very important. Small-sized transistors will have an important impact on the performance of electronic products. When the size of transistors is smaller, the current transmission time and energy consumption can be reduced to achieve fast calculation. And energy-s...

AI Technical Summary

Problems solved by technology

The traditional method of cleaning the chamber is to directly brush off the dirt on the inner surface of the chamber. However, because the attached precursors are very dense, the cleaning process is time-consuming and labor-intensive, and causes additional cleaning costs. It may even be difficult to completely remove the attached precursors. Precursors, and the cleaning cycle needs to be shortened, resulting in a decrease in production line production efficiency

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