Unlock instant, AI-driven research and patent intelligence for your innovation.

Crystal grain, module, wafer and manufacturing method of crystal grain

A die and module technology, which is applied in semiconductor/solid-state device manufacturing, antenna support/mounting device, semiconductor/solid-state device components, etc. Difficulties, saving the number of types, and solving the effect of a long development cycle

Active Publication Date: 2021-04-20
深圳荣耀智能机器有限公司
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present application provides a method for manufacturing a crystal grain, a module, a wafer, and a crystal grain. The minimum repetitive functional unit among M modules with the same functional unit can be defined as the minimum standard unit. In this way, in different The combination and multiplexing of the smallest standard units with the same function can be realized in the module, which can save the number of types of wafers and solve the problems of long development cycle and difficult stocking of wafers.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Crystal grain, module, wafer and manufacturing method of crystal grain
  • Crystal grain, module, wafer and manufacturing method of crystal grain
  • Crystal grain, module, wafer and manufacturing method of crystal grain

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0060] In order to clearly describe the technical solutions of the embodiments of the present application, in the embodiments of the present application, words such as "first" and "second" are used to distinguish the same or similar items with basically the same function and effect. For example, the first crystal grain and the second crystal grain are only used to distinguish different crystal grains, and the order of the crystal grains is not limited. Those skilled in the art can understand that the words "first", "second" and the like do not limit the quantity and execution order, and the words "first", "second" and the like are not necessarily different.

[0061] It should be noted that, in the embodiments of the present application, words such as "exemplary" or "for example" are used to represent examples, illustrations, or illustrations. Any embodiment or design described in this application as "exemplary" or "such as" should not be construed as preferred or advantageous ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a crystal grain, a module, a wafer and a manufacturing method of the crystal grain. The minimum repetitive function unit in M modules with the same function unit is defined as the minimum standard unit, so that the combination and reuse of the minimum standard units with the same function can be realized when different modules are manufactured; and therefore, the number of types of wafers can be reduced, and the problems of long wafer development period, difficult stocking and the like are solved.

Description

technical field [0001] The present application relates to the field of chip technology, and in particular, to a die, a module, a wafer, and a method for manufacturing the die. Background technique [0002] With the continuous updating of electronic devices, the modules in electronic devices have developed rapidly, and different modules can achieve different functions. For example, a system in package module (system in package module, SIP module) may include functions such as power supply, baseband, storage, and radio frequency, where a radio frequency (radio frequency, RF) SIP module refers to a radio frequency function module, used for Realize radio frequency receiving and transmitting functions, etc. [0003] Usually, the SIP module interconnects different dies, RC devices, etc. on the substrate, so that the SIP module can achieve certain functions; among them, the dies are obtained by cutting the wafer, so different SIP modules can achieve certain functions. Modules req...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L25/16H01L23/66H01L21/78H01L21/50H01Q1/22
CPCH01L21/78H01L21/50H01L23/66H03F3/195H01L2223/6611H01L2223/6655H03F2200/294H03F2200/111H03F2200/451H03F2203/7209H03F3/72H01L27/0207H01L25/50H03F3/19
Inventor 黄清华孙江涛王统刘钢
Owner 深圳荣耀智能机器有限公司