Die, module, wafer and method of manufacturing die
A manufacturing method and die technology, applied in semiconductor/solid-state device manufacturing, antenna support/installation device, semiconductor/solid-state device components, etc., can solve problems such as difficulty in stocking, long wafer development cycle, etc., to save species number, solve the difficulty of stocking, and solve the effect of long development cycle
Active Publication Date: 2021-06-29
深圳荣耀智能机器有限公司
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[0005] The embodiment of the present application provides a method for manufacturing a crystal grain, a module, a wafer, and a crystal grain. The minimum repetitive functional unit among M modules with the same functional unit can be defined as the minimum standard unit. In this way, in different The combination and multiplexing of the smallest standard units with the same function can be realized in the module, which can save the number of types of wafers and solve the problems of long development cycle and difficult stocking of wafers.
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[0060] In order to clearly describe the technical solutions of the embodiments of the present application, in the embodiments of the present application, words such as "first" and "second" are used to distinguish the same or similar items with basically the same function and effect. For example, the first crystal grain and the second crystal grain are only used to distinguish different crystal grains, and their sequence is not limited. Those skilled in the art can understand that words such as "first" and "second" do not limit the number and execution order, and words such as "first" and "second" do not necessarily limit the difference.
[0061] It should be noted that, in the embodiments of the present application, words such as "exemplary" or "for example" are used as examples, illustrations or descriptions. Any embodiment or design described herein as "exemplary" or "for example" is not to be construed as preferred or advantageous over other embodiments or designs. Rather,...
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The embodiment of the present application provides a method for manufacturing a crystal grain, a module, a wafer, and a crystal grain, by defining the minimum repetitive functional unit among M modules with the same functional unit as the minimum standard unit, so that in different The combination and multiplexing of the smallest standard units with the same function can be realized during module production, which can save the number of types of wafers and solve the problems of long development cycle and difficult stocking of wafers.
Description
technical field [0001] The present application relates to the field of chip technology, and in particular to a crystal grain, a module, a wafer and a method for manufacturing the crystal grain. Background technique [0002] With the continuous updating of electronic equipment, the modules in the electronic equipment have developed rapidly, and different modules can realize different functions. For example, a system in package module (system in package module, SIP module) may include functions such as power supply, baseband, storage, radio frequency, etc., wherein, a radio frequency (radio frequency, RF) SIP module refers to a radio frequency function module, which is used for Realize radio frequency receiving and transmitting functions, etc. [0003] Usually, a SIP module interconnects different crystal grains, resistance-capacitance sensing devices, etc. Modules require different wafer designs. [0004] However, different modules usually include functional units with dif...
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IPC IPC(8): H01L25/16H01L23/66H01L21/78H01L21/50H01Q1/22
CPCH01L21/78H01L21/50H01L23/66H03F3/195H01L2223/6611H01L2223/6655H03F2200/294H03F2200/111H03F2200/451H03F2203/7209H03F3/72H01L27/0207H01L25/50H03F3/19
Inventor 黄清华孙江涛王统刘钢
Owner 深圳荣耀智能机器有限公司