A splitting knife device for wafer splitting and using method thereof

Abstract

The invention discloses a splitting knife equipment for wafer splitting and a method of using the same in the technical field of splitting knife equipment for wafer splitting. The bottom of the bracket is fixedly connected with the first electric push rod; the present invention utilizes the first split plate that can move upward to realize the dislocation with the second split plate by setting the structure of the first cleaning device, the limiting device and the second cleaning device, and then To achieve the purpose of automatically falling off loose wafer fragments between the two gaps, and at the same time using the repulsive force between the second magnet and the first magnet, the first magnet drives the cleaning plate to the first fragment through the second L-shaped plate. The wafer fragments that are tightly adhered on the side of the plate and the second split plate are cleaned, and the cleaned wafer fragments will directly fall on the sealing plate to be cleaned. The cleaning process is simple and fast, and the work efficiency is further improved.

Description

technical field [0001] The invention relates to the technical field of splitting knife equipment for wafer splitting, in particular to a splitting knife equipment for wafer splitting and a method of use thereof. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. Various circuit element structures can be processed on the wafer. Usually, the surface with the circuit element structure is called the front surface, and the opposite surface is called the back surface. In the process of wafer processing, it is often necessary to The wafer is adhered to a wafer carrier frame, the wafer carrier frame includes a stretch film frame and a film, the film is adhered to the stretch film frame, the film has a certain tension, and the wafer is adhered to the film. [0003] In the invention case of a wafer splitting device disclosed in the prior art, the Chin...

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Problems solved by technology

[0004] When wafer splitting is performed in the prior art, the wafer is divided by using different heights. During the division, the wafer division surface is more likely to produce cracked wafer debris, which is easy to be sucked into and stuck in the height In the notches formed by different faces, not only is it time-consuming and laborious to clean up, but it is also easy to damage the subsequent processed wafers

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