Cutting device for silicon single crystal rod

Abstract

The invention relates to a cutting device for a silicon single crystal rod. The cutting device comprises a fixed box, a base, a cutting mechanism, a moving mechanism and a clamping mechanism, wherein the cutting mechanism comprises a driving box, a rotating rod and a blade, the clamping mechanism comprises a piston cylinder, an abutting plate, a moving rod, a spring, a piston and a clamping assembly, and the moving mechanism comprises a lead screw, a bearing seat, a walking ring, a connecting rod, a moving block and a positioning box. By using the cutting device for the silicon single crystal rod, movement of a main body and control on the cutting amount of the main body are both achieved through the moving mechanism, so that the cutting size of the main body is conveniently adjusted; the main body is automatically clamped through the clamping mechanism and can automatically fall off through restoring force of the spring without disassembling the main body by opening the fixed box for multiple times, so that the use practicability is improved; and in addition, the clamping mechanism herein is of a pure mechanical structure and clamps the main body through thrust of the main body, so that the service life is prolonged.

Description

technical field [0001] In particular, the invention relates to a cutting device for monocrystalline silicon rods. Background technique [0002] Monocrystalline silicon is an important part of crystalline materials and is at the forefront of the development of new materials. It is used to make high-power rectifiers, high-power transistors, diodes, switching devices, etc. It is a promising material in the development of energy. In industrial production, silicon rods grow rod-shaped single crystal silicon from the furnace body by using the Czochralski method or suspension zone melting method. Some monocrystalline silicon rod cutting devices manually push the single crystal silicon rod for cutting, the cutting thickness cannot be effectively controlled, some are thick, some are thin, and the cutting surface is prone to unevenness, which is insufficient There will be sparks and dust, and the working environment is poor. Contents of the invention [0003] The technical problem...

AI Technical Summary

Problems solved by technology

[0002] Monocrystalline silicon is an important part of crystalline materials and is at the forefront of the development of new materials. It is used to make high-power rectifiers, high-power transistors, diodes, switching devices, etc. It is a promising material in the development of energy. In industrial production, silicon rods grow rod-shaped single crystal silicon from the furnace body by using the Czochralski method or suspension zone melting method. Some monocrystalline silicon rod cutting devices manually push the single crystal silicon rod for cutting, the cutting thickness cannot be effectively controlled, some are thick, some are thin, and the cutting surface is prone to unevenness, which is insufficient There will be sparks and dust, and the working environment is poor

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