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Microcomponent transfer device and transfer method

A transfer device and micro-component technology, which is applied in the manufacturing of electrical components, semiconductor devices, semiconductor/solid-state devices, etc., can solve the problems of low yield, low efficiency, difficult debonding and cleaning of MicroLED, and achieves improved transfer efficiency, Improve pick-up yield and facilitate transfer of micro-components

Active Publication Date: 2022-03-25
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, currently using temporary bonding glue to temporarily bond Micro LEDs for laser lift-off has the problems of difficult debonding and cleaning, and the current temporary substrate and transfer head still have the problem of low yield and low efficiency of picking up Micro LEDs

Method used

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  • Microcomponent transfer device and transfer method
  • Microcomponent transfer device and transfer method
  • Microcomponent transfer device and transfer method

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Embodiment Construction

[0022] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are part of the implementation of the present invention. example, not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

[0023] In order to solve the technical problem of low transfer efficiency of micro components in the prior art, an embodiment of the present invention provides a transfer device for micro components. The transfer device includes a carrier substrate and a...

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Abstract

The invention relates to the technical field of display panels, and discloses a micro-element transfer device and a transfer method. The transfer device includes a carrier substrate and a transfer table. The carrying substrate is used to carry the micro components peeled off from the growth substrate, and the carrying substrate is provided with a plurality of first air holes arranged in an array. The transfer workbench is provided with a first gas controller and a first gas channel. After the carrier substrate is placed on the transfer workbench, each first air hole is respectively connected to the first gas controller through the first gas channel. The first gas controller is used for Provide negative pressure to the first air hole through the first gas channel to increase the adhesion of the carrier substrate to the micro-element, or provide positive pressure to the first air hole through the first gas channel to reduce the adhesion of the carrier substrate to the micro-element Focus on. Through the above method, the present invention can improve the transfer efficiency of micro elements.

Description

technical field [0001] The invention relates to the technical field of display panels, in particular to a micro-element transfer device and a transfer method. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is an optoelectronic semiconductor element, which has the advantages of low power consumption, small size, high brightness, easy matching with integrated circuits, and high reliability, and is widely used as a light source. Moreover, with the maturity of LED technology, the technology of directly using LEDs as LED displays or Micro LED (miniature light emitting diode) displays of self-luminous display dot pixels is gradually being widely used. [0003] Among them, the Micro LED display integrates the technical characteristics of TFT-LCD and LED display. Transfer to a receiving substrate. However, currently using temporary bonding glue to temporarily bond Micro LEDs for laser lift-off has the problems of difficult debonding and cleaning, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L21/683
CPCH01L33/0095H01L21/6838
Inventor 李晓伟曹轩
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD