Packaging structure and packaging method of high-speed 25g semiconductor laser chip

Abstract

The invention relates to the field of laser chip processing, and discloses a packaging structure and method for a high-speed 25G semiconductor laser chip. The packaging structure of the high-speed 25G semiconductor laser chip includes: a packaging shell and a semiconductor embedded in the packaging shell The laser body consists of two composite substrates with multiple heat transfer coefficients welded on the upper and lower sides of the package housing, and at least two composite substrates perpendicular to the composite substrate are arranged between the two composite substrates. A transitional heat sink block, a semiconductor laser body is arranged between the two adjacent transitional heat sink blocks, thus, by packaging the semiconductor laser body to two composite substrates with multiple thermal heat transfer coefficients and the transition Between the heat sink blocks, the heat dissipation efficiency of the semiconductor laser body is improved, thereby improving the laser beam quality of the laser.

Description

technical field [0001] The invention relates to the field of laser chip processing, in particular to a packaging structure and packaging method for a high-speed 25G semiconductor laser chip. Background technique [0002] In recent years, semiconductor lasers have developed rapidly due to their laser technology, and play a vital role in today's society. With its small size, light weight, high reliability, low power consumption, high efficiency, and long life, semiconductor lasers have been widely used in many fields such as military, industry, communication, medicine, and scientific research, and are the most developed in the future. Laser light source in the foreground. Chip packaging is a method of directly soldering chips on heat sinks of different structures and materials. [0003] At present, high-speed optical transmitters above 10Gb / s are usually packaged in a butterfly shape to improve the performance of the device. However, the heat dissipation of the existing semi...

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Problems solved by technology

[0005] The main purpose of the present invention is to provide a high-speed 25G semiconductor laser chip packaging structure and packaging method, aiming to solve the problem of poor heat dissipation of the existing semiconductor laser packaging structure, which causes the abnormal temperature of the environment where the laser chip is located, thus causing the laser beam Technical issues with reduced quality

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