A chemical mechanical planarization device and its application

Abstract

The invention discloses a chemical mechanical planarization device and its application. The chemical mechanical planarization device includes a wafer carrier, a polishing pad arranged on the wafer carrier, and a wafer installed on the polishing pad. The bearing base, the first base installed on the outside of the wafer carrier, and the release arm, one end of the release arm is connected to the first base, the other end extends to the center of the polishing pad, and the inside of the release arm It includes a first delivery tube and a second delivery tube, through which a first type of liquid is provided to clean the surface of the polishing pad, and at the same time, the release arm is used to press the polishing pad to remove the first type of liquid, through The second conveying pipe provides the second type of liquid to flow to the surface of the polishing pad to form a layer of polishing liquid to grind the wafer. The chemical mechanical planarization equipment provided by the invention and its application can reduce the waste of grinding liquid, reduce wafer damage, and prevent mixing of different liquids.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing equipment, in particular to chemical mechanical planarization equipment and its application. Background technique [0002] Chemical Mechanical Planarization (CMP) is an ultra-precise surface processing process for global planarization in integrated circuit (Integrated Circuit, IC) manufacturing. In chemical mechanical polishing, the wafer is placed on a rotating wafer carrier with the fixed top face down, and is pressed on the rotating surface of the polishing pad with the abrasive liquid distributed on it. In order to ensure that the abrasive liquid covers the surface of the polishing pad, the required outflow Larger, and a large amount of abrasive liquid is thrown out, resulting in waste. At the same time, due to the porosity of the material of the polishing pad, the polishing pad will be mirrored during chemical mechanical polishing, reducing the grinding rate. At this time, it is ne...

AI Technical Summary

Problems solved by technology

In chemical mechanical polishing, the wafer is placed on a rotating wafer carrier with the fixed top face down, and pressed on the rotating surface of the polishing pad with abrasive liquid distributed on it. In order to ensure that the abrasive liquid is covered with the surface of the polishing pad, the required outflow Larger, and a large amount of grinding fluid is thrown out, resulting in waste

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