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Thermal printing head

A thermal print head and substrate technology, applied in printing and other directions, can solve the problems of reduced durability of thermal print heads and other issues

Pending Publication Date: 2021-04-30
ROHM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the durability of the thermal print head is reduced
This becomes more of a problem when the protective layer on the resistive layer is formed thin

Method used

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  • Thermal printing head
  • Thermal printing head
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Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach >

[0091] Figure 1 to Figure 6An example of the thermal printhead of the present invention is shown. The thermal printhead A1 of this embodiment includes a substrate 1 , a glaze layer 2 , an electrode layer 3 , a resistor layer 4 , a protective layer 5 , a driver IC 71 , a sealing resin 72 , a connector 73 , a wiring board 74 and a heat sink 75 . The thermal head A1 is a component that can be incorporated into a printer that prints with the conveyed printing medium 82 sandwiched between the thermal head A1 and the platen roller 81 . As such a printing medium 82, thermal paper used for creating a barcode sheet or a receipt can be mentioned, for example.

[0092] figure 1 is a plan view showing the thermal head A1. figure 2 is along figure 1 The sectional view of line II-II. image 3 It is an enlarged plan view showing main parts of the thermal print head A1. Figure 4 is along image 3 An enlarged cross-sectional view of the main part of line IV-IV. Figure 5 ~ Figure 6 ...

no. 2 approach >

[0146] Figure 11 A thermal print head according to a second embodiment of the present invention is shown. The shape of the first protective layer 51 of the thermal head A2 of this embodiment is different from the above-mentioned embodiment. In this embodiment, the upstream end of the second downstream portion 512 b does not extend to the vicinity of the resistance layer 4 . Therefore, the distance ha from the substrate 1 to the top part 516a of the upstream second part is larger than the distance h1 from the substrate 1 to the glaze top part 223 as in the first embodiment, and the distance h1 from the substrate 1 to the second part on the downstream side is greater than that of the first embodiment. The distance hb to the partial top 516b is smaller than the distance h1. In the present embodiment, the upstream second partial ceiling 516a also corresponds to the "second partial ceiling" in the present invention.

[0147] In the present embodiment, the distance ha is also th...

no. 3 approach >

[0150] Figure 12 A thermal print head according to a third embodiment of the present invention is shown. The structure of the first protective layer 51 of the thermal print head A3 of this embodiment is different from the above-mentioned embodiment.

[0151]In this embodiment, the downstream end of the second upstream portion 512 a and the upstream end of the second downstream portion 512 b do not extend to the vicinity of the resistance layer 4 . Therefore, the distance ha from the substrate 1 to the upstream second portion top 516a and the distance hb from the substrate 1 to the downstream second portion top 516b are smaller than the distance h1 from the substrate 1 to the glaze top 223. . On the other hand, the second portion 512 of the first protection layer 51 has a separated second portion 512c. The separated second portion 512c is formed at a distance from the upstream second portion 512a and the downstream second portion 512b between the upstream second portion 512...

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Abstract

The invention provides a thermal printing head. The thermal printing head (A1) comprises a substrate (1), heating glaze (22), a resistive layer (4) and a protective layer (5). The protective layer (5) includes: a first protective layer (51) having a first portion (511) that overlaps the resistive layer (4) in the z-direction and a second portion (512) that does not overlap the resistive layer (4) and is thicker than the first portion (511); and a second protective layer (52) disposed on the opposite side of the substrate (1) with respect to the first protective layer (51) and overlapping the resistive layer (4) in the z direction. The second portion (512) has an upstream side second portion top (516a), and the heating glaze (22) has a glaze top (223). The distance (ha) from the substrate (1) to the upstream side second portion top (516a) is greater than the distance (h1) from the substrate (1) to the glaze top (223). According to the thermal printing head, the wear amount of the protective layer can be suppressed.

Description

technical field [0001] The invention relates to a thermal printing head. Background technique [0002] Patent Document 1 discloses an example of a conventional thermal print head. The thermal print head disclosed in this document includes a substrate, an electrode layer, a resistive layer and a protective layer. The electrode layer is stacked on the substrate through photolithography, and the resistance layer is arranged on the upper surface of the electrode layer. The protective layer is laminated so as to cover the resistor layer and the electrode layer. The protective layer is formed by applying a glass paste mainly composed of glass and firing it. [0003] In recent years, increased printing speed has been pursued. As the printing speed increases, the amount of wear of the protective layer increases. Therefore, the durability of the thermal head decreases. This becomes more of a problem when the protective layer on the resistive layer is formed thin. [0004] prio...

Claims

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Application Information

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IPC IPC(8): B41J2/335
CPCB41J2/335B41J2/3351B41J2/3353B41J2/33535B41J2/33545B41J2/3354
Inventor 西宏治
Owner ROHM CO LTD