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Manufacturing method of LTCC circuit substrate

A technology for circuit substrates and manufacturing methods, which is applied in the fields of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of limited advantages in substrate control, and achieve the effects of low cost, simple and easy method, and reduced warpage

Active Publication Date: 2021-04-30
AEROSPACE INFORMATION RES INST CAS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method can only control the flatness of local through holes, and has little advantage in controlling the overall flatness of the substrate.

Method used

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  • Manufacturing method of LTCC circuit substrate
  • Manufacturing method of LTCC circuit substrate

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Embodiment Construction

[0017] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0018] figure 1 A schematic flowchart of a method for manufacturing a circuit substrate according to an embodiment of the present invention is schematically shown.

[0019] Such as figure 1 As shown, the method includes operations S101-S105.

[0020] In operation S101, a position recognition point for product shape processing is set during product typesetting.

[0021] According to an embodiment of the present invention, the position identification point is also referred to as a reference point, which provides a common measurable point for all steps in the substrate surface mount process.

[0022] According to an embodiment of the present invention, the position identification point of product shape processing includes...

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Abstract

The invention provides a manufacturing method of an LTCC circuit substrate. The manufacturing method comprises the following steps: setting a position identification point for product appearance processing during product layout; reserving a process edge with a preset size outside the position identification point, and setting a hot cutting alignment point on the process edge; cutting the raw porcelain blank according to the hot cutting alignment points to finish conversion from the raw porcelain blank to the raw porcelain blank of a single circuit; carrying out hot pressing treatment on the raw porcelain blank of the single circuit, and completing co-firing treatment of the LTCC circuit substrate through a co-firing process; and according to an LTCC circuit substrate shape processing technology, completing shape cutting of each circuit substrate to realize manufacturing of the LTCC circuit substrates.

Description

technical field [0001] The invention relates to the field of LTCC substrates, in particular to a method for manufacturing an LTCC circuit substrate. Background technique [0002] LTCC (Low Temperature Co-fired Ceramics) technology is a high-density, multi-layer wiring circuit substrate and packaging technology. Sintering process to realize the production of circuit substrates. LTCC technology can form passive components inside the circuit substrate, combined with the surface mount process of active devices, to realize the production of high-density and high-integration components, which is the preferred way for the integration and modularization of electronic devices in the future. [0003] The sintering process of the LTCC substrate is a process of exothermic and endothermic reactions. At the stage of low temperature to 450°C, the organic components in the substrate are volatilized and discharged, and at the stage of high temperature of 700°C-860°C, the components in the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/00
Inventor 赵燕邓云凯喻忠军徐正霍锐张长凤赵元沛
Owner AEROSPACE INFORMATION RES INST CAS