ALD automatic feeding and discharging machine

Abstract

The invention discloses an ALD automatic feeding and discharging machine which comprises a flower basket feeding module, a flower basket wafer sending module, a silicon wafer conveying module, a suction cup material taking and carrying module, a graphite frame positioning station, a graphite frame carrier conveying module, a silicon wafer discharging and conveying module, a silicon wafer flower basket wafer receiving module, a flower basket discharging module and a rack. The flower basket feeding module is fixedly installed at one side of the end face of the rack, a flower basket wafer sending module is installed at one side of the flower basket feeding module in a connected manner, the silicon wafer conveying module is installed at one side of the flower basket wafer sending module in a connected manner, and the suction cup material taking and carrying module is arranged at one side of the outer portion of the silicon wafer conveying module; and the center of the end face of the rack is connected with the graphite frame positioning station. The ALD automatic feeding and discharging machine is stable and firm in overall structure; and during use, feeding and discharging are stable and fast, the suction area of suction cups is large, stability is effectively improved, deviation caused by suction of the suction cups can be reduced, and the positioning accuracy is greatly improved.

Description

technical field [0001] The invention relates to the field of automatic loading and unloading equipment, in particular to an ALD automatic loading and unloading machine. Background technique [0002] The full name of ALD, Atomic Layer Deposition, refers to atomic layer deposition technology, which is mainly used in the fields of VLSI, OLED and advanced packaging. During the processing of silicon wafers, ALD automatic loading and unloading machines are needed. Due to the small size and low thickness of silicon wafers, it is necessary to use a loading and unloading machine to load and unload silicon wafers; traditional loading and unloading equipment has slow loading and unloading efficiency, and when using ordinary suction cups for suction, the contact The area is small and the suction is small, which reduces the stability of the material and causes the suction to deviate. Because of the small suction, the material is easy to fall off and affects the loading and unloading. Th...

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Problems solved by technology

Due to the small size and low thickness of silicon wafers, it is necessary to use a loading and unloading machine to load and unload silicon wafers; traditional loading and unloading equipment has slow loading and unloading efficiency, and when using ordinary suction cups for suction, the contact The area is small and the suction is small, which reduces the stability of the material and causes the suction to deviate. Because of the small suction, the material is easy to fall off and affects the loading and unloading. Therefore, it is necessary to design an ALD automatic loading and unloading machine.

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