The invention relates to the technical field of micro-grid control, in particular to a formula for a water cup decoration
colloid and a use method thereof. 85 to 95 parts of
epoxy resin; the
bisphenol A type
epoxy resin is selected, has excellent
adhesive force and
chemical resistance, can be stably combined with various cup materials, and is moderate in flowability, so that subsequent spot
coating and spraying operation is facilitated. In the formula, the
mass ratio of the
epoxy resin to the curing agent is controlled within the range of 6: 1-17: 1 and can be adjusted according to the material of the water cup: for rigid materials such as stainless steel and glass, the proportion of the curing agent can be slightly higher, and the
bonding strength of
colloid and a base material is improved; aiming at
plastic materials, the proportion of the curing agent is low, so that the
colloid is prevented from falling off due to
internal stress after being cured. The formula has the advantages that the colloid only contains two core components, namely the epoxy resin and the curing agent, the formula is simple, the raw materials are easy to obtain, the cost is low, meanwhile, the colloid can be matched with various cup materials such as stainless steel, glass and plastic by adjusting the proportion of the epoxy resin and the curing agent, and compatibility is high.