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Chip circuit board production method

A production method and circuit board technology, applied in printed circuit, printed circuit manufacturing, electrical components, etc., can solve problems such as cleaning and maintenance by engineers, resource waste, equipment life troubles, etc., to facilitate detection and maintenance, prolong practical life, The effect of ensuring the accuracy of operation

Active Publication Date: 2021-05-07
深圳市恒晟辉电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of science and technology, electronic products have also ushered in vigorous development. In the process of vigorous development of electronic products, in the process of control and operation of electronic products, oxidation, dust, and loose keys have a certain impact on the life of electronic products. At the same time, the development of electronic products is developing in the direction of precision and lightness. Non-professional engineers cannot perform correct cleaning and maintenance, which also causes certain troubles to the life of the equipment, and at the same time forms a waste of resources; therefore Precise and firm installation of electronic products has become a trend of electronic products, further improving the life of electronic products and reducing the number of maintenance. Therefore, the existing technology has defects and needs to be improved

Method used

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  • Chip circuit board production method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039]Embodiment 1, printing the conductive adhesive base layer and the fixing seat, according to the design requirements of a single PCB design, select and evaluate the layout structure of the PCB, and design the optimal layout structure. In the layout design, if the button position structure is single, and When the typesetting printing direction is consistent, the typesetting size can be larger. According to the sheet material structure, 41*49inch, 43*49inch and 37*41inch sheet material structure, carry out typesetting in four parts. For structures with inconsistent printing directions, you must Appropriate amount is used to reduce the typesetting according to the cutting utilization rate, and the cutting direction is consistent.

[0040] Make stencils according to cutting materials, select different mesh stencils according to the thickness of the underlying conductive adhesive, and prepare conductive adhesives with corresponding viscosities at the same time. When the thickn...

Embodiment 2

[0043] Example 2, operate according to the method of Example 1, after screen printing, place the fixed base on the conductive glue, the printing area of ​​the conductive glue and the area of ​​the base are 0.5mm smaller on one side, and then place the fixed base on the conductive glue. The method of hot-pressing treatment is, under the condition that the temperature is 175-185°C and the pressure is 95-105KG, after pre-pressing for 8-12s, press for 110-130s.

Embodiment 3

[0044] In Example 3, the screen printing is changed to tape with dots, and a conductive tape is placed at a designated position. The conductive tape is pasted on the PCB, and then fixed and quickly produced by stencil printing or heat pressing on the base.

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Abstract

The invention provides a chip circuit board production method. The method comprises the steps of typesetting, platemaking, preprinting alignment, silk-screen printing, prebaking, steel mesh printing and board baking operation, realizes printing of a PCB production board which has a certain shape of bulges and plays a role in fixedly mounting keys on a PCB, and prevents a copper foil from being exposed in air for a long time to generate oxidation reaction, so as to prolong the service lives of the keys; in addition, a parting line is arranged, and copper is exposed on the parting line, so that local contact between the keys and the PCB is realized, and detection and maintenance are facilitated. By additionally arranging grooves in an organic conductive adhesive, the keys can be accommodated in the grooves, so that the keys cannot swing left and right in the use process, and the operation accuracy of the keys is ensured; and meanwhile, elastic protrusions are arranged on the two sides of the grooves and can replace springs in the keys, and rapid and convenient installation is achieved.

Description

technical field [0001] The invention relates to a process flow method of circuit board printing, in particular to a method for producing a chip circuit board. Background technique [0002] With the development of science and technology, electronic products have also ushered in vigorous development. In the process of vigorous development of electronic products, in the process of control and operation of electronic products, oxidation, dust, and loose keys have a certain impact on the life of electronic products. At the same time, the development of electronic products is developing in the direction of precision and lightness. Non-professional engineers cannot perform correct cleaning and maintenance, which also causes certain troubles to the life of the equipment and forms a waste of resources; therefore Precise and firm installation of electronic products has become a trend of electronic products, further improving the life of electronic products and reducing maintenance tim...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/12
CPCH05K3/00H05K3/1225H05K3/1233
Inventor 姚金才朱超群陈宇
Owner 深圳市恒晟辉电子有限公司
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