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Chip electroplating system and chip electroplating control method

A chip and electroplating solution technology, applied in the fields of printed circuit manufacturing, electrical components, electrolysis process, etc., can solve problems such as electroplating copper pits

Active Publication Date: 2021-05-18
泉芯集成电路制造(济南)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the electroplating process, the air attached to the surface of the chip will generate bubbles and adhere to the surface of the chip when it contacts the electroplating solution, so that the copper ions cannot react normally on the surface of the chip during the electroplating process to form a flat copper structure. Plating copper pit defect

Method used

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  • Chip electroplating system and chip electroplating control method
  • Chip electroplating system and chip electroplating control method
  • Chip electroplating system and chip electroplating control method

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Embodiment Construction

[0045] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of them. The components of the embodiments of the application generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0046] Accordingly, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art w...

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Abstract

The invention provides a chip electroplating system and a chip electroplating control method, and relates to the technical field of integrated circuit manufacturing. Electroplating liquid is contained in a containing groove of a liquid containing device, a push plate with the plate face parallel to the bottom surface of the containing groove is arranged in the containing groove, a pneumatic cylinder arranged on the liquid containing device is connected to the push plate through a transmission rod, and the pneumatic cylinder drives the push plate to move in the electroplating liquid in order to adjust the height of the electroplating liquid level. Chip clamping equipment clamps a to-be-plated chip to move towards the groove bottom of the containing groove, and then control equipment electrically connected to the pneumatic cylinder and the chip clamping equipment controls the working state of the pneumatic cylinder and the working state of the chip clamping device, so that the pneumatic cylinder and the chip clamping equipment are matched with each other to immerse the to-be-plated chip into the electroplating liquid, two opposite pressures are applied to bubbles attached to the surface of the chip to enhance the bubble extrusion force, air residues on the surface of the chip in the electroplating liquid immersion process are reduced as much as possible, and the defect of electroplating copper pits is overcome.

Description

technical field [0001] The present application relates to the technical field of integrated circuit manufacturing, in particular, to a chip electroplating system and a chip electroplating control method. Background technique [0002] The electroplating process is an extremely important process technology in the integrated circuit manufacturing process. It is necessary to immerse the chip in the electroplating solution in the form of facing down, and use the chemical reaction characteristics of copper ions to make the electroplating solution react on the surface of the chip to form a copper structure. Thus, the entire electroplating process is completed. During the electroplating process, the air attached to the surface of the chip will generate bubbles and adhere to the surface of the chip when it contacts the electroplating solution, so that the copper ions cannot react normally on the surface of the chip to form a flat copper structure during the electroplating process. E...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00C25D17/08C25D21/04C25D21/12C25D7/00H05K3/18
CPCC25D7/00C25D17/00C25D17/08C25D21/04C25D21/12H05K3/188
Inventor 林英乔
Owner 泉芯集成电路制造(济南)有限公司
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