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Chip electroplating system and chip electroplating control method

A chip and electroplating solution technology, which is applied in the fields of printed circuit manufacturing, electrolytic components, electrolytic process, etc., can solve problems such as electroplating copper pits, achieve the effects of enhancing the force of extrusion, reducing air residue, and improving the defects of electroplating copper pits

Active Publication Date: 2021-11-02
泉芯集成电路制造(济南)有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the electroplating process, the air attached to the surface of the chip will generate bubbles and adhere to the surface of the chip when it contacts the electroplating solution, so that the copper ions cannot react normally on the surface of the chip during the electroplating process to form a flat copper structure. Plating copper pit defect

Method used

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  • Chip electroplating system and chip electroplating control method
  • Chip electroplating system and chip electroplating control method
  • Chip electroplating system and chip electroplating control method

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Embodiment Construction

[0045] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of them. The components of the embodiments of the application generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0046] Accordingly, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art w...

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Abstract

The application provides a chip electroplating system and a chip electroplating control method, which relate to the technical field of integrated circuit manufacturing. In this application, the electroplating solution is contained in the storage tank of the liquid storage device, and a push plate with a plate surface parallel to the bottom surface of the tank is arranged in the storage tank. The pneumatic cylinder installed on the liquid storage device is connected with the push plate through a transmission rod. The push plate is driven by the pneumatic cylinder to move in the electroplating liquid to adjust the height of the electroplating liquid. In this application, the chip to be plated is clamped by the chip clamping device and moved towards the bottom of the accommodating tank, and then the control equipment electrically connected to the pneumatic cylinder and the chip clamping device controls the respective pressure of the pneumatic cylinder and the chip clamping device. The working state is controlled so that the pneumatic cylinder and the chip holding device cooperate with each other to immerse the chip to be plated in the electroplating solution, and apply two opposing pressures on the air bubbles attached to the surface of the chip to enhance the force of air bubble extrusion, thereby reducing the electroplating as much as possible. Air remains on the surface of the chip during the immersion process, improving the defects of electroplating copper pits.

Description

technical field [0001] The present application relates to the technical field of integrated circuit manufacturing, in particular, to a chip electroplating system and a chip electroplating control method. Background technique [0002] The electroplating process is an extremely important process technology in the integrated circuit manufacturing process. It is necessary to immerse the chip in the electroplating solution in the form of facing down, and use the chemical reaction characteristics of copper ions to make the electroplating solution react on the surface of the chip to form a copper structure. Thus, the entire electroplating process is completed. During the electroplating process, the air attached to the surface of the chip will generate bubbles and adhere to the surface of the chip when it contacts the electroplating solution, so that the copper ions cannot react normally on the surface of the chip to form a flat copper structure during the electroplating process. E...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/00C25D17/08C25D21/04C25D21/12C25D7/00H05K3/18
CPCC25D7/00C25D17/00C25D17/08C25D21/04C25D21/12H05K3/188
Inventor 林英乔
Owner 泉芯集成电路制造(济南)有限公司
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