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Multi-layer chip varistor and manufacturing method thereof

A varistor, multi-layer chip technology, used in varistors, resistors, non-adjustable metal resistors, etc., can solve problems such as shedding

Inactive Publication Date: 2021-05-18
淮安市泽邦电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when packaging, the packaging film and the base film are often directly connected by bonding, so that it is easy to fall off when it is subjected to tension.

Method used

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  • Multi-layer chip varistor and manufacturing method thereof
  • Multi-layer chip varistor and manufacturing method thereof
  • Multi-layer chip varistor and manufacturing method thereof

Examples

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Embodiment Construction

[0026] like Figure 1-3 Shown is the multilayer chip varistor and its manufacturing method of the present invention, including the multilayer chip varistor, including the base film 1 and the packaging film 2, the base film 1 and the packaging film 2 are connected by a snap-fitting component, The base film 1 and the packaging film 2 of the piezoresistor are not easy to fall off by providing the engaging parts.

[0027] Specifically, the engaging part includes a first stretched film 3 disposed on the base film 1 and a second stretched film 4 disposed on the packaging film 2, the first stretched film 3 and the second stretched film 4 are respectively connected to The base film 1 and the packaging film 2 are integrally formed, the first stretched film 3 covers the top of the second stretched film 4, at least one set of connecting pieces 5 is arranged on the second stretched film 4, and the first stretched film 3 A through hole 6 for the connection piece 5 to pass is provided, and...

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Abstract

The invention discloses a multi-layer chip varistor and a manufacturing method thereof, and relates to the field of varistors, the multi-layer chip varistor comprises a base film and a packaging film, and the base film and the packaging film are connected through a clamping part. According to the multi-layer chip varistor and the manufacturing method thereof, the clamping component is arranged, so that the base film and the packaging film of the varistor are not easy to fall off.

Description

technical field [0001] The invention relates to the field of varistors, in particular to a multilayer chip varistor and a manufacturing method thereof. Background technique [0002] Varistors are widely used in household appliances and other electronic products due to their advantages such as large flow density, strong voltage limiting ability, fast response speed, wide application voltage, and high energy absorption capacity. Voltage protection, lightning protection, surge current suppression, noise elimination, etc. [0003] Multilayer chip varistors, because of their small size, easy automatic placement and other advantages, meet people's requirements for thinner and lighter electrical and electronic products and production processes, so they are more and more valued and favored by people. . [0004] However, when encapsulating, the encapsulating film and the base film are often directly connected by bonding, so that it is easy to fall off when it is subjected to tensio...

Claims

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Application Information

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IPC IPC(8): H01C7/102H01C7/10H01C17/02
CPCH01C7/102H01C7/10H01C17/02
Inventor 丁有群
Owner 淮安市泽邦电子有限公司
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